Semiconductor circuit structure and method for fabricating the semiconductor circuit structure
A circuit structure has at least two etching trenches disposed at sidewalls of a silicon block left behind during the etching of the structure. The etching trenches are disposed at angles with respect to one another that are prescribed by the form of the silicon block left behind. Semiconductor layer structures which can interact with one another diagonally across are in each case accommodated in the etching trenches. In this case, the function of the entire circuit structure results from the interaction of the layer structures disposed in the various etching trenches.
1. A circuit structure, comprising:
a silicon substrate having at least two etching trenches formed therein and defining a silicon block having sidewalls, said etching trenches etched out in a manner adjoining said sidewalls of said silicon block, said etching trenches disposed at angles with respect to one another prescribed by a form of said silicon block, said etching trenches including a first etching trench and a second etching trench disposed adjacent said first etching trench;
first and second doped diffusion regions extending from said first and second etching trenches into said silicon block and having an overlap region; and
layer structures disposed in said etching trenches, said layer structures including conductive structures disposed in said etching trenches, said conductive structures within said first etching trench and said conductive structures within said second etching trench being electrically connected to one another by said first and second diffusion regions extending from said first and second etching trenches into said silicon block.
2. The circuit structure according to claim 1 , further comprising field-effect transistors formed within said etching trenches and said silicon block, each of said field-effect transistors having a first diffusion region functioning as a first source/drain region and extending into said silicon block, a conductive gate region, and a second diffusion region functioning as a second source/drain region and extending into said silicon block, a conductive channel being formed between said first and second source/drain regions in dependence on a potential of said conductive gate region.
3. The circuit structure according to claim 1 , further comprising regions have at least one of different doping concentrations and different conductivity types are disposed within said silicon block.
4. The circuit structure according to claim 1 , further comprising voltage supply lines and signal lines for said layer structures are in each case accommodated in one of said etching trenches.
5. The circuit structure according to claim 4 , wherein:
said voltage supply lines and said signal lines are in each case accommodated in said first etching trench;
said layer structures are accommodated in said second etching trench; and
said layer structures have interconnections accommodated in said second etching trench.
6. The circuit structure according to claim 1 , wherein said silicon block is a silicon parallelepiped.
7. The circuit structure according to claim 6 , wherein said etching trenches are four etching trenches disposed around said silicon parallelepiped.
8. The circuit structure according to claim 1 , wherein the circuit structure is an SRAM memory cell.
9. The circuit structure according to claim 8 , wherein the SRAM memory cell contains a plurality of field-effect transistors interconnected to form a flip-flop and a selection transistor.
10. The circuit structure according to claim 9 , wherein:
said silicon block has a p-doped region and an n-doped region; and
said field-effect transistors interconnected to form said flip-flop contain both n-FETs and p-FETs, said n-FETs being disposed in a region of said p-doped region of said silicon block, and said p-FETs being disposed in a region of said n-doped region of said silicon block.
11. The circuit structure according to claim 9 ,
wherein said selection transistor has a source-drain path; and
further comprising a bit line disposed at a surface of said silicon substrate, said flip-flop connected to said bit line through said source-drain path of said selection transistor.
12. The circuit structure according to claim 9 , further comprising a word line disposed in said etching trenches, said selection transistor being activated by said word line.
13. The circuit structure according to claim 12 ,
wherein said word line serves as a gate region of said selection transistor; and
further comprising a gate oxide layer disposed between said word line and said silicon block.
14. The circuit structure according to claim 11 , wherein said silicon block has an upper region being a doped region and said bit line disposed at said surface of said silicon substrate being contact-connected to said upper region.
15. The circuit structure according to claim 14 , wherein said upper region formed as said doped region serves as one of a source electrode and a drain electrode of said selection transistor.
16. The circuit structure according to claim 1 , wherein said conductive structures disposed are formed from polysilicon.
17. The circuit structure according to claim 1 , wherein said layer structures are semiconductor layer structures.
18. An array configuration, comprising:
a multiplicity of circuit structures, including:
a silicon substrate having at least two etching trenches formed therein and defining silicon blocks having sidewalls, said etching trenches etched out in a manner adjoining said sidewalls of said silicon blocks, said etching trenches disposed at angles with respect to one another prescribed by a form of said silicon blocks, said etching trenches including a first etching trench and a second etching trench disposed adjacent said first etching trench;
first and second doped diffusion regions extending from said first and second etching trenches into said silicon block and having an overlap region; and
layer structures disposed in said etching trenches, said layer structures including conductive structures disposed in said etching trenches, said conductive structures within said first etching trench and said conductive structures within said second etching trench being electrically connected to one another by said first and second diffusion regions extending from said first and second etching trenches into said silicon block.
19. The array configuration according to claim 18 ,
wherein said etching trenches disposed in each case in a manner adjoining a specific sidewall of said silicon blocks are lengthened to form continuous etching trenches extending across a plurality of said silicon blocks; and
further comprising voltage supply lines and signal lines accommodated in said continuous etching trenches.
20. An array configuration, comprising:
a silicon substrate having at least two etching trenches formed therein and defining silicon blocks having sidewalls, said etching trenches etched out in a manner adjoining said sidewalls of said silicon blocks, said etching trenches disposed at angles with respect to one another prescribed by a form of said silicon blocks, said etching trenches including a first etching trench and a second etching trench disposed adjacent said first etching trench;
first and second doped diffusion regions extending from said first and second etching trenches into said silicon block and having an overlap region; and
layer structures disposed in said etching trenches and forming a multiplicity of SRAM memory cells, said layer structures including conductive structures disposed in said etching trenches, said conductive structures within said first etching trench and said conductive structures within said second etching trench being electrically connected to one another by said first and second diffusion regions extending from said first and second etching trenches into said silicon block.
21. The array configuration according to claim 20 ,
wherein said etching trenches disposed in each case in a manner adjoining a specific sidewall of said silicon blocks are lengthened to form continuous etching trenches extending across a plurality of said silicon blocks; and
further comprising voltage supply lines and signal lines accommodated in said continuous etching trenches.
22. A circuit structure, comprising:
a silicon substrate having at least two etching trenches formed therein and defining a silicon block having sidewalls, said etching trenches etched out in a manner adjoining said sidewalls of said silicon block, said etching trenches disposed at angles with respect to one another prescribed by a form of said silicon block; and
layer structures disposed in said etching trenches, said layer structures forming an SRAM memory cell.
23. The circuit structure according to claim 22 , wherein the SRAM memory cell contains a plurality of field-effect transistors interconnected to form a flip-flop and a selection transistor.