Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device
View Patent ↗Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device. According to one embodiment, a method is provided for producing a composite comprising a tested integrated circuit and an electrical device. The method can include applying a flexible elevation to a circuit substrate of the integrated circuit. Further, the method can include providing a rewiring device on the circuit substrate. The method can also include carrying out of a test of the integrated circuit with temporary utilization of the contact-making device on the flexible elevation. Further, the method can include applying solder to a contact device of the electrical device. The method can also include placing the tested integrated circuit onto the electrical device. In addition, the method can include reliquifying the solder to form a connection between the intergrated circuit and the electrical device.
1. Method for producing a composite comprising a tested integrated circuit and an electrical device, having the following steps:
(a) applying a flexible elevation to a circuit substrate of the integrated circuit;
(b) providing a rewiring device on the circuit substrate with the formation of a ring around the flexible elevation and on the flexible elevation with the formation of a contact-making device on the flexible elevation, the ring and the contact-making device being electrically conductively connected to one another;
(c) carrying out of a test of the integrated circuit with temporary utilization of the contact-making device on the flexible elevation;
(c) applying solder to a contact device of the electrical device;
(d) placing the tested integrated circuit or the circuit substrate onto the electrical device with the contact-making device being aligned with the contact device—provided with solder—of the electrical device; and
(e) reliquifying the solder in such a way that it forms a permanent, fixed, electrically conductive connection between the integrated circuit and the electrical device, wherein the solder completely surrounds the flexible elevation upon reliquifaction.
2. Method according to claim 1 , wherein the electrical device is a further tested intergrated circuit and/or a printed circuit board.