Memory module having space-saving arrangement of memory chips and memory chip therefore

1. A module comprising:

a module board having a main surface;

a plurality of semiconductor chips arranged on the main surface of the module board, each semiconductor chip comprising:

two main surfaces extending between a first end face and a second end face of the semiconductor chip;

first mounting sites mounted to the main surface of the module board;

second mounting sites spaced apart from the first mounting sites and mounted to support sites spaced apart from the module board,

so that a distance between the first end face and the module board is greater than a distance between the second end face and the module board,

wherein the second mounting sites of at least one of the semiconductor chips are mounted to conductive structures on a surface of an adjacent chip, said conductive structures extending along the surface so as to electrically connect said second mounting sites directly to terminals on the module board.

2. The module according to claim 1 , further comprising a support structure to which the second mounting sites of at least one of the memory semiconductor chips are mounted.

3. The module according to claim 1 , wherein the first mounting sites are formed by a first row of terminals of the semiconductor chips, which are connected to associated terminals on the module board.

4. The module according to claim 3 , wherein the second mounting sites of at least one semiconductor chip are formed by a second row of terminals, which are connected to a conductive structure on a support wherein the conductive structure is implemented to connect the second row of terminals directly to associated terminals on the module board.

5. The module according to claim 4 , wherein the support is one of a main surface of an adjacent semiconductor chip, a surface of a dedicated support structure, a main surface of a capacitor chip, or a heat-sink provided on an adjacent semiconductor chip.

6. The module according to claim 1 , wherein a capacitor is formed on a main surface of at least one of the semiconductor chips.

7. The module according to claim 1 , further comprising a capacitor chip comprising:

two main surfaces extending between a first end face and a second end face of the capacitor chip;

first mounting sites mounted to the main surface of the module board;

second mounting sites spaced apart on the first mounting sites and mounted to support sites spaced apart from the module board, so that a distance between the first end face and the module board is greater than a distance between the second end face and the module board;

a first capacitor terminal, a second capacitor terminal and a capacitor connected between the first and the second capacitor terminals,

wherein the first capacitor terminal is connected to a first power supply plane on the module board and the second capacitor terminal is connected to a second power supply plane on the module board.

8. The module according to claim 1 , wherein the module board has two main surfaces and wherein a respective plurality of semiconductor chips is arranged on both main surfaces of the module board.

9. The module according to claim 1 , wherein the semiconductor chips comprise memory chips.

10. The module according to claim 9 , further comprising a support structure to which the second mounting sites of at least one of the memory chips are mounted.

11. The module according to claim 9 , wherein the first mounting sites are formed by a first row of terminals of the memory chips, which are connected to associated terminals on the module board.

12. The module according to claim 11 , wherein the second mounting sites of at least one memory chip are formed by a second row of terminals, which are connected to a conductive structure on a support wherein the conductive structure is implemented to connect the second row of terminals directly to associated terminals on the module board.

13. The module according to claim 12 , wherein the support is one of a main surface of an adjacent memory chip, a surface of a dedicated support structure, a main surface of a capacitor chip, or a heat-sink provided on an adjacent memory chip.

14. The module according to claim 9 , wherein a capacitor is formed on a main surface of at least one of the memory chips.

15. The module according to claim 9 , further comprising a capacitor chip comprising:

two main surfaces extending between a first end face and a second end face of the capacitor chip;

first mounting sites mounted to the main surface of the module board;

second mounting sites spaced apart on the first mounting sites and mounted to support sites spaced apart from the module board, so that a distance between the first end face and the module board is greater than a distance between the second end face and the module board;

a first capacitor terminal, a second capacitor terminal and a capacitor connected between the first and the second capacitor terminals,

wherein the first capacitor terminal is connected to a first power supply plane on the module board and the second capacitor terminal is connected to a second power supply plane on the module board.

16. The module according to claim 9 , wherein the module board has two main surfaces and wherein a respective plurality of memory chips is arranged on both main surfaces of the module board.

17. Memory module comprising:

a module board having a main surface;

a plurality of memory chips arranged on the main surface of the module board, each memory chip comprising:

two main surfaces extending between a first end face and a second end face of the memory chip;

first mounting sites mounted to the main surface of the module board;

second mounting sites spaced apart from the first mounting sites and mounted to support sites spaced apart from the module board,

so that a distance between the first end face and the module board is greater than a distance between the second end face and the module board,

wherein the second mounting sites of at least one memory chip are formed by a second row of terminals, which are connected to a conductive structure on a support wherein the conductive structure is implemented to connect the second row of terminals to associated terminals on the module board, and

wherein the support is a heat-sink provided on an adjacent memory chip.

18. Memory module comprising:

a module board having a main surface;

a plurality of memory chips arranged on the main surface of the module board, each memory chip comprising:

two main surfaces extending between a first end face and a second end face of the memory chip;

first mounting sites mounted to the main surface of the module board;

second mounting sites spaced apart from the first mounting sites and mounted to support sites spaced apart from the module board,

so that a distance between the first end face and the module board is greater than a distance between the second end face and the module board,

wherein said memory module further comprises a capacitor chip comprising:

two main surfaces extending between a first end face and a second end face of the capacitor chip;

first mounting sites mounted to the main surface of the module board;

second mounting sites spaced apart on the first mounting sites and mounted to support sites spaced apart from the module board, so that a distance between the first end face and the module board is greater than a distance between the second end face and the module board;

a first capacitor terminal, a second capacitor terminal and a capacitor connected between the first and the second capacitor terminals,

wherein the first capacitor terminal is connected to a first power supply plane on the module board and the second capacitor terminal is connected to a second power supply plane on the module board.