Method for producing a phase mask

1. A method for producing a phase mask for the projection or reflection of a structure into an image plane, comprising:

providing a substrate;

forming a first semitransparent layer on the substrate, wherein the first semitransparent layer is configured to add a first phase rotation to a light beam passing through the first semitransparent layer;

forming a second semitransparent layer on the first semitransparent layer, wherein the second semitransparent layer is configured to add a second phase rotation to a light beam passing through the second semitransparent layer;

removing selected portions of the first and the second semitransparent layers in the vicinity of at least two partial regions on the substrate so as to form at least two first structure elements at the at least two partial regions of the substrate, wherein each of the first structure elements comprises the first and second semitransparent layers and has a first degree of transmission; and

removing the second semitransparent layer at one of the at least two partial regions so as to form a second structure element with a second degree of transmission, wherein the second degree of transmission differs from the first degree of transmission.

2. The method of claim 1 , wherein the first semitransparent layer comprises molybdenum silicide.

3. The method of claim 1 , wherein the second semitransparent layer comprises at least one of chromium and silver.

4. The method of claim 1 , wherein the first degree of transmission is more than 15%.

5. The method of claim 1 , wherein the second degree of transmission is more than 30%.

6. The method of claim 1 , wherein at least two first structure elements are formed with a minimum lateral extent and a selected distance from one another, the distance being more than twice the minimum lateral extent.

7. The method of claim 1 , wherein at least two second structure elements are formed with a minimum lateral extent and a selected distance from one another, the distance being equal to the minimum lateral extent.

8. The method of claim 7 , wherein a multiplicity of second structure elements are formed on the substrate, said second structure elements being arranged as a periodic line-gap pattern on the substrate.

9. The method of claim 1 , further comprising:

producing a memory chip by exposure of the first and second structure elements.

10. A method for producing a phase mask for the projection or reflection of a structure into an image plane, comprising:

providing a substrate;

forming a first semitransparent layer with a first degree of transmission at least partially directly on the substrate, wherein the first semitransparent layer is configured to add a first phase rotation to a light beam passing through the first semitransparent layer;

removing the first semitransparent layer in a first partial region on the substrate so as to form a first structure on the substrate comprising the first semitransparent layer with the first degree of transmission;

forming a second semitransparent layer with a second degree of transmission at least partially directly on the substrate, wherein the second semitransparent layer is configured to add a second phase rotation to a light beam passing through the layer, the second degree of transmission differing from the first degree of transmission; and

removing the second semitransparent layer in a second partial region on the substrate so as to form at least one second elevated structure element on the substrate comprising the second semitransparent layer with the second degree of transmission.

11. The method of claim 10 , wherein the forming the first semitransparent layer comprises etching the substrate to form a depression, and filling the depression with the first semitransparent layer.

12. The method of claim 11 , wherein the removal of the first semitransparent layer is accomplished at least in part via chemical mechanical polishing.

13. A phase mask for the projection or reflection of a structure into an image plane, the phase mask comprising a substrate, a first structure element supported by the substrate and comprising at least one semitransparent material, the first structure element having a first degree of transmission, and a second structure element supported by the substrate and comprising at least one semitransparent material, the second structure element having a second degree of transmission that is different from the first degree of transmission, wherein the first structure element includes a first semitransparent layer that is disposed on the substrate and comprises a first material that is configured to add a first phase rotation to a light beam passing through the first semitransparent layer, the first structure element further comprises a second semitransparent layer that is disposed on the substrate and comprises a second material that is configured to add a second phase rotation to a light beam passing through the second semitransparent layer, and the second structure element includes a semitransparent layer that comprises the first material.

14. The phase change mask of claim 13 , wherein the first material comprises molybdenum silicide, and the second material comprises at least one of chromium and silver.

15. A phase mask for the projection or reflection of a structure into an image plane, the phase mask comprising a substrate, a first structure element supported by the substrate and comprising at least one semitransparent material, the first structure element having a first degree of transmission, and a second structure element supported by the substrate and comprising at least one semitransparent material, the second structure element having a second degree of transmission that is different from the first degree of transmission, wherein the first structure element is disposed within a depression within the substrate, the second structure element is disposed on a surface of the substrate, the first structure element comprises molybdenum silicide, and the second material comprises silver.