IP Library Granted Patent US 7,177,169
Granted Patent B2
US 7,177,169 · App. 11/103,185 · Granted Feb 13, 2007

Word line arrangement having multi-layer word line segments for three-dimensional memory array

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Quick Facts
Patent No.
US 7,177,169
App. No.
11/103,185
Granted
Feb 13, 2007
Kind
B2
Abstract

A three-dimensional (3D) passive element memory cell array provides short word lines while still maintaining a small support circuit area for efficiency. Short, low resistance word line segments on two or more word line layers are connected together in parallel to form a given word line without use of segment switch devices between the word line segments. A shared vertical connection preferably connects the word line segments together and connects to a word line driver circuit disposed generally below the array near the word line. Each word line driver circuit preferably couples its word line either to an associated one of a plurality of selected bias lines or to an unselected bias line associated with the driver circuit, which selected bias lines are themselves decoded to provide for an efficient multi-headed word line decoder.

Claims (42)

1. An integrated circuit comprising a three-dimensional passive element memory cell array, said memory array comprising a plurality of segmented word lines, each segmented word line comprising at least one word line segment on each of at least two word line layers that are connected together in parallel, said memory array comprising memory cells respectively formed between a word line segment disposed on a word line layer and respective bit lines disposed on an associated bit line layer.

2. The integrated circuit of claim 1 wherein each respective word line comprises at least one word line segment on each word line layer connected together by way of a respective single vertical connection.

3. The integrated circuit of claim 1 wherein said memory array comprises memory cells respectively formed between a word line segment disposed on a word line layer and respective bit lines disposed on each of two associated bit line layers.

4. The integrated circuit of claim 1 wherein each bit line layer is associated with at most one word line layer.

5. The integrated circuit of claim 1 comprising anti-fuse memory cells.

6. The integrated circuit of claim 1 comprising fuse memory cells.

7. The integrated circuit of claim 1 wherein the array is configured to simultaneously program a group of at least two memory cells associated with a single word line.

8. The integrated circuit of claim 7 wherein at most one memory cell of a simultaneously programmed group of memory cells is coupled to an individual word line segment.

9. The integrated circuit of claim 7 wherein each word line, when selected for programming, is driven by an N-channel transistor to a selected programming bias level.

10. The integrated circuit of claim 1 comprising word lines including a respective word line segment in each of two adjacent blocks of the memory array which share a vertical connection.

11. The integrated circuit of claim 1 wherein the memory array comprises a plurality of array blocks and the word line segments in each array block are interleaved.

12. The integrated circuit of claim 11 comprising word lines including a respective word line segment in each of two adjacent blocks of the memory array which share a vertical connection.

13. The integrated circuit of claim 11 further comprising a multi-headed word line decoder circuit having a plurality of select nodes, each select node being coupled to a respective group of at least one word line driver circuit for each respective one of at least three blocks of the array.

14. The integrated circuit of claim 13 including word lines respectively comprising at least one word line segment on each word line layer connected together by way of a respective single vertical connection.

15. The integrated circuit of claim 14 wherein the array is configured to simultaneously program a group of at least two memory cells associated with a single word line.

16. The integrated circuit of claim 15 wherein each word line, when selected for programming, is driven by an N-channel transistor to a selected programming bias level.

17. The integrated circuit of claim 1 wherein the array is configured to simultaneously program a group of at least two memory cells associated with a single word line.

18. The integrated circuit of claim 17 wherein each word line, when selected for programming, is driven by an N-channel transistor to a selected programming bias level.

19. The integrated circuit of claim 1 further comprising a multi-headed word line decoder circuit having a plurality of select nodes, each select node being coupled to a respective group of at least one word line driver circuit for each respective one of at least three blocks of the array.

20. The integrated circuit of claim 19 wherein:

each block includes a respective plurality of N selected bias lines; and

each select node of the multi-headed word line decoder circuit is coupled to a respective group of N word line driver circuits associated with a block, each coupled to a respective one of the N selected bias lines.

21. The integrated circuit of claim 20 wherein each respective selected bias line is operably driven to a selected bias level by a respective first circuit arranged to initially drive the line from an unselected bias level toward the selected bias level, and by a second circuit for subsequently providing a lower impedance path to the selected bias level.

22. The integrated circuit of claim 21 wherein the respective second circuit for each respective selected bias line comprises a plurality of spatially distributed circuits operably coupling the respective selected bias line to a source of the selected bias level.

23. The integrated circuit of claim 20 wherein each memory block includes an unselected bias line shared by all word line driver circuits associated with the block.

24. The integrated circuit of claim 1 wherein each of said bit lines traverses across an array block.

25. The integrated circuit of claim 1 wherein each of said bit lines is segmented, being operably coupled to an associated global bit line disposed on another layer of the array.

26. A method for programming three-dimensional passive element memory cell array, said memory array comprising a plurality of segmented word lines, each segmented word line comprising at least one word line segment on each of at least two word line layers that are connected together in parallel, said memory array comprising memory cells respectively formed between a word line segment disposed on a word line layer and respective bit lines disposed on an associated bit line layer, said method comprising the steps of:

selecting a word line in the array;

selecting a bit line associated with the selected word line;

coupling the selected word line to a source of a suitable programming bias level; and

coupling the selected bit line to either a suitable programming bias level or an inhibit bias level in accordance with a data bit to be programmed, to thereby program a memory cell coupled between the selected bit line and the selected word line.

27. The method of claim 26 further comprising:

selecting a second bit line associated with the selected word line; and

coupling the second selected bit line to either a suitable programming bias level or an inhibit bias level in accordance with a second data bit to be programmed, to thereby program a second memory cell coupled between the second selected bit line and the selected word line.

28. The method of claim 26 wherein the memory cells comprise anti-fuse memory cells.

29. The method of claim 26 wherein coupling the selected word line comprises:

driving the selected word line to a selected bias line; and

driving the selected bias line to the source of the suitable programming bias level by a respective first circuit arranged to initially drive the selected bias line from an unselected bias level toward the suitable programming bias level, and by a second circuit for subsequently providing a lower impedance path to the suitable programming bias level.

30. A computer readable medium encoding an integrated circuit, said encoded integrated circuit comprising a three-dimensional passive element memory cell array, said memory array comprising a plurality of segmented word lines, each segmented word line comprising at least one word line segment on each of at least two word line layers that are connected together in parallel, said memory array comprising memory cells respectively formed between a word line segment disposed on a word line layer and respective bit lines disposed on an associated bit line layer.

31. The computer readable medium of claim 30 wherein each respective word line comprises at least one word line segment on each word line layer connected together by way of a respective single vertical connection.

32. The computer readable medium of claim 30 wherein the encoded integrated circuit comprises fuse memory cells.

Assignments (5)
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038813/0004 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT LISTED PATENT NUMBER 8853569 TO THE CORRECT PATENT NUMBER 8883569 PREVIOUSLY RECORDED ON REEL 038300 FRAME 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECTIVE MERGER TO ADD PAGES TO THE MERGER DOCUMENT PREVIOUSLY RECORDED PREVIOUSLY RECORDED ON REEL 017544 FRAME 0769. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 2, 2007
From: MATRIX SEMICONDUCTOR, INC.
To: SANDISK 3D LLC
Reel/Frame 018950/0686 →
MERGER Recorded Apr 28, 2006
From: MATRIX SEMICONDUCTOR, INC.
To: SANDISK 3D LLC
Reel/Frame 017544/0769 →