Method of assembling semiconductor devices with LEDs
View Patent ↗Methods of forming integrated circuit packages having an LED molded into the package, and the integrated circuit package formed thereby. An integrated circuit including one or more semiconductor die, passive components and an LED may be assembled on a panel. The one or more semiconductor die, passive components and LED may all then be encapsulated in a molding compound, and the integrated circuits then singularized to form individual integrated circuit packages. The integrated circuits are cut from the panel so that a portion of the lens of the LED is severed during the singularization process, and an end of the lens remaining within the package lies flush with an edge of the package to emit light outside of the package.
1. A method forming an integrated circuit package, comprising the steps of:
(a) encapsulating a plurality of integrated circuits within a molding compound, each integrated circuit including one or more semiconductor die and a light emitting diode; and
(b) separating a first encapsulated integrated circuit from a second encapsulated integrated circuit, said step of separating comprising the step of severing a portion of the light emitting diode in the first encapsulated integrated circuit to leave an end of the light emitting diode in the first integrated circuit flush with an edge of the first integrated circuit.
2. A method as recited in claim 1 , said step (b) of separating the first encapsulated integrated circuit from the second encapsulated integrated circuit comprising the step of leaving an amount of unused molding compound between the first and second integrated circuits, the portion of the light emitting diode severed in said step (b) remaining in said amount of unused molding compound after the first and second encapsulated integrated circuits are separated.
3. A method as recited in claim 1 , the light emitting diode in the first integrated circuit sharing a lens with the light emitting diode in the second integrated circuit, the step (b) of separating the first encapsulated integrated circuit from the second encapsulated integrated circuit comprising severing the lens and leaving a first portion of the severed lens in the in the first integrated circuit flush with an edge of the first integrated circuit and a second portion of the lens in the second integrated circuit package flush with an edge of the second integrated circuit.
4. A method as recited in claim 1 , the first integrated circuit further comprising a second light emitting diode, said step (a) further comprising the step of encapsulating the second light emitting diode in the first integrated circuit, and said step (b) further comprising the step of severing a portion of the second light emitting diode in the first encapsulated integrated circuit to leave an end of the light emitting diode in the first integrated circuit flush with an edge of the first integrated circuit.
5. A method forming an integrated circuit package, comprising the steps of:
(a) encapsulating an integrated circuit with a molding compound, the integrated circuit including one or more semiconductor die and a light emitting diode; and
(b) cutting along an edge of the encapsulated integrated circuit, said step of cutting comprising the step of severing a portion of the light emitting diode in the encapsulated integrated circuit to leave an end of the light emitting diode in the integrated circuit flush with the edge of the integrated circuit.
6. A method as recited in claim 5 , further comprising the step of enclosing the encapsulated integrated circuit within one ore more lids.
7. A method as recited in claim 5 , said step (b) of cutting comprising the step of cutting through the molding compound and light emitting diode by one of water jet cutting, laser cutting, water guided laser cutting, dry media cutting, and diamond coated wire cutting.
8. A method forming an integrated circuit package, comprising the steps of:
(a) mounting one or more semiconductor die on a base;
(b) mounting a light emitting diode on the base;
(c) encapsulating the one or more semiconductor die and the light emitting diode within a molding compound; and
(d) cutting the encapsulated one or more semiconductor die and light emitting diode from the base, said step of cutting comprising the step of severing a portion of the light emitting diode to leave an end of the light emitting diode flush with an edge of the cut integrated circuit package.
9. A method as recited in claim 8 , further comprising the step of enclosing the integrated circuit package within one ore more lids.
10. A method as recited in claim 8 , further comprising the step of mounting one or more passive components on the base.
11. A method as recited in claim 8 , said step (d) of cutting comprising the step of cutting through the molding compound and light emitting diode by one of water jet cutting, laser cutting, water guided laser cutting, dry media cutting, and diamond coated wire cutting.