STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
An integrated circuit package system having stacked lead frames including providing a first stackable lead frame package having a first integrated circuit therein and a second stackable lead frame package with a second integrated circuit therein. The first stackable lead frame package having a plurality of leads including protrusions is mounted to the second stackable lead frame package having a second plurality of leads including protrusions.
1 . A stacked integrated circuit package system comprising:
providing a first stackable lead frame package having a first integrated circuit therein, the first stackable lead frame package having a first plurality of leads including a first plurality of protrusions therein;
providing a second stackable lead frame package having a second integrated circuit therein, the second stackable lead frame package having a second plurality of leads including a second plurality of protrusions therein; and
mounting the first stackable lead frame package and the second stackable lead frame package.
2 . The system as claimed in claim 1 wherein mounting the first stackable lead frame package to the second stackable lead frame package comprises mating the first plurality of protrusions to the second plurality of protrusions.
3 . The system as claimed in claim 1 wherein mounting the first stackable lead frame package to the second stackable lead frame package comprises a first plurality of extensions of the first plurality of protrusions complimentary and mating to a second plurality of extensions of the second plurality of protrusions.
4 . The system as claimed in claim 1 wherein mounting the first stackable lead frame package to the second stackable lead frame package comprises applying an epoxy to secure the first stackable lead frame package to the second stackable lead frame package.
5 . The system as claimed in claim 1 further comprising forming electrical connections between the first stackable lead frame package and the second stackable lead frame package.
6 . A stacked integrated circuit package system comprising:
providing a first lead frame having a first plurality of leads including a first plurality of protrusions;
mounting a first integrated circuit on the first lead frame;
encapsulating the first lead frame and the first integrated circuit forming a first stackable lead frame package;
providing a second lead frame having a second plurality of leads including a second plurality of protrusions;
mounting a second integrated circuit on the second lead frame;
encapsulating the second lead frame and the second integrated circuit forming a second stackable lead frame package; and
mounting the first stackable lead frame package and second stackable lead frame package.
7 . The system as claimed in claim 6 wherein mounting the first stackable lead frame package to the second stackable lead frame package comprises mating the first plurality of protrusions and the second plurality of protrusions.
8 . The system as claimed in claim 6 wherein mounting the first stackable lead frame package to the second stackable lead frame package comprises a first plurality of extensions of the first plurality of protrusions complimentary and mating to a second plurality of extensions of the second plurality of protrusions.
9 . The system as claimed in claim 6 wherein mounting the first stackable lead frame package to the second stackable lead frame package comprises applying an epoxy to secure the first stackable lead frame package to the second stackable lead frame package.
10 . The system as claimed in claim 6 further comprising forming electrical connections between the first stackable lead frame package and second stackable lead frame packages.
11 . A stacked integrated circuit package system comprising:
a first stackable lead frame package having a first integrated circuit therein, the first stackable lead frame package having a first plurality of leads including a first plurality of protrusions therein; and
a second stackable lead frame package having a second integrated circuit therein, the second stackable lead frame package having a second plurality of leads including a second plurality of protrusions therein, and wherein the first stackable lead frame package is mounted to the second stackable lead frame package.
12 . The system as claimed in claim 11 wherein the first stackable lead frame package is mounted to the second stackable lead frame package mating the first plurality of protrusions to the second plurality of protrusions.
13 . The system as claimed in claim 11 wherein the first stackable lead frame package is mounted to the second stackable lead frame package comprises a first plurality of extensions of the first plurality of protrusions complimentary and mated to a second plurality of extensions of the second plurality of protrusions.
14 . The system as claimed in claim 11 wherein the first stackable lead frame package mounted to the second stackable lead frame package comprises an epoxy applied to secure the first stackable lead frame package to the second stackable lead frame package.
15 . The system as claimed in claim 11 wherein the first plurality of protrusions and the second plurality of protrusions electrically connect the first stackable lead frame package to the second stackable lead frame package.
16 . A stacked integrated circuit package system comprising:
a first stackable lead frame package, encapsulated, comprising having a first lead frame having a first plurality of leads including a first plurality of protrusions, the first stackable lead frame package further comprising a first integrated circuit;
a second stackable lead frame package, encapsulated, comprising having a second lead frame having a second plurality of leads including a second plurality of protrusions, the second stackable lead frame package further comprising a second integrated circuit; and
the first stackable lead frame package mounted to the second stackable lead frame package mating the first plurality of protrusions to the second plurality of protrusions.
17 . The system as claimed in claim 16 wherein the first stackable lead frame package is mounted to the second stackable lead frame package comprises a first plurality of extensions of the first plurality of protrusions complimentary and mated to a second plurality of extensions of the second plurality of protrusions.
18 . The system as claimed in claim 16 wherein the first stackable lead frame package mounted to the second stackable lead frame package comprises an epoxy applied to secure the first stackable lead frame package to the second stackable lead frame package.
19 . The system as claimed in claim 16 wherein mating the first plurality of protrusions to the second plurality of protrusions comprises a conductive epoxy.
20 . The system as claimed in claim 16 wherein the first plurality of protrusions and the second plurality of protrusions electrically connect the first stackable lead frame package to the second stackable lead frame package.