Air pocket resistant semiconductor package
View Patent ↗A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An encapsulant encapsulates the die, the substrate, at least a portion of the heat spreader, the first encapsulant guide, and the heat spreader air vent such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vent, thus preventing the formation of air pockets under the heat spreader.
1. An air pocket resistant semiconductor package, comprising:
a substrate;
a die attached to the substrate;
a heat spreader enclosing the die, the heat spreader further comprising:
a first encapsulant guide, wherein the first encapsulant guide is located at the center of the heat spreader extending therethrough;
a second encapsulant guide positioned on the external surface of the heat spreader, the second encapsulant guide connecting an edge of the heat spreader to the first encapsulant guide; and
a heat spreader air vent incorporated in the heat spreader, extending therethrough, and configured for preventing the formation of air pockets under the heat spreader during encapsulation of the die, the substrate, and the heat spreader with an encapsulant such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vent.
2. The semiconductor package of claim 1 wherein;
the substrate further comprises a pin one guide; and
the heat spreader enclosing the die comprises the heat spreader air vent positioned at the base of the heat spreader.
3. The semiconductor package of claim 1 wherein the first encapsulant guide is configured to be a depression in the top of the heat spreader with at least an opening through the heat spreader in the depression.
4. An air pocket resistant semiconductor package, comprising:
a substrate;
a die;
an epoxy attaching the die to the substrate, the substrate with a pin one guide;
a plurality of conductive wires electrically connecting the die to the substrate;
a heat spreader enclosing the die and the plurality of conductive wires;
a first encapsulant guide located at the center of the heat spreader;
a second encapsulant guide positioned on the external surface of the heat spreader, the second encapsulant guide connecting a top edge of the heat spreader at a corner opposite to the pin one guide to the first encapsulant guide located at the center of the heat spreader;
a plurality of corners having one corner of the heat spreader aligned with the pin one guide; a plurality of heat spreader air vents incorporated in the heat spreader extending therethrough the heat spreader air vents positioned at the base of the heat spreader at all corners; and
the first encapsulant guide and the heat spreader air vents being configured for preventing the formation of air pockets under the heat spreader during encapsulation of the die, the substrate, the conductive wires, and the heat spreader with an encapsulant such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vents by:
contacting the surface of the heat spreader with the mold,
providing the mold with an injection port, and
aligning the injection port with the pin one guide.
5. The semiconductor package of claim 4 wherein the first encapsulant guide is configured to be a depression in the top of the heat spreader with at least an opening through the heat spreader in the depression.