IP Library Granted Patent US 7,263,007
Granted Patent B2
US 7,263,007 · App. 11/228,777 · Granted Aug 28, 2007

Semiconductor memory device using read data bus for writing data during high-speed writing

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,263,007
App. No.
11/228,777
Granted
Aug 28, 2007
Kind
B2
Abstract

A semiconductor device is provided that can perform simultaneous writing of a large number of bits, without an increase in chip size. This semiconductor device includes: a write data bus via which data are written into memory cells; a read data bus via which the data are read from the memory cells; a first write amplifier that writes data into the memory cells via the read data bus at the time of high-speed writing; a second write amplifier that writes data into the memory cells via the write data bus at the time of high-speed writing; a first sense amplifier that reads verified data from the memory cells via the read data bus; and a second sense amplifier that reads verified data from the memory cells via the write data bus.

Claims (58)

1. A semiconductor device comprising:

a write data bus via which data are written into memory cells;

a read data bus via which data are read from the memory cells; and

a first write amplifier that writes data into the memory cells via the read data bus at the time of given writing.

2. The semiconductor device as claimed in claim 1 , further comprising

a second write amplifier that writes data into the memory cells via the write data bus at the time of given writing.

3. The semiconductor device as claimed in claim 1 , further comprising:

shield lines that shield the read data bus; and

an additional write amplifier that writes data into the memory cells via the shield lines at the time of given writing.

4. The semiconductor device as claimed in claim 1 , further comprising

a first sense amplifier that reads verified data from the memory cells via the read data bus.

5. The semiconductor device as claimed in claim 1 , further comprising

a sense amplifier that reads verified data from the memory cells via the write data bus.

6. The semiconductor device as claimed in claim 3 , further comprising

a sense amplifier that reads verified data from the memory cells via the shield lines.

7. The semiconductor device as claimed in claim 1 , further comprising

a sense amplifier that reads data from the memory cells via the read data bus.

8. The semiconductor device as claimed in claim 1 , further comprising

a cell array including a plurality of banks in which data are read from a first one of the banks while data are written into a second one of the banks.

9. The semiconductor device as claimed in claim 3 , further comprising:

a cell array including a plurality of banks in which data are read from a first one of the banks while data are written into a second one of the banks; and

sense amplifiers each of which is provided for a respective one of the banks, each of the sense amplifiers reading data from the memory cells via the read data bus.

10. The semiconductor device as claimed in claim 3 , further comprising

a cell array including a plurality of banks in which data are read from a first one of the banks while data are written into a second one of the banks,

wherein the read data bus is provided for each of the banks.

11. The semiconductor device as claimed in claim 1 , further comprising:

a cell array including a plurality of banks in which data are read from a first one of the banks while data are written into a second one of the banks; and

a select circuit that generates a select signal for bank selection.

12. The semiconductor device as claimed in claim 1 , further comprising

a switch that connects the first write amplifier to the read data bus at the time of given writing.

13. The semiconductor device as claimed in claim 3 , further comprising

a switch that connects the third write amplifier to the shield lines at the time of given writing.

14. The semiconductor device as claimed in claim 1 , further comprising:

a cell array including a plurality of banks in which data are read from a first one of the banks while data are written into a second one of the banks; and

a switch that selects one of the banks to be connected to the read data bus.

15. The semiconductor device as claimed in claim 3 , further comprising:

a cell array including a plurality of banks in which data are read from a first one of the banks while data are written into a second one of the banks; and

a switch that selects one of the banks to be connected to the shield lines.

16. The semiconductor device as claimed in claim 1 , wherein the read data bus has a larger number of lines than the write data bus.

17. The semiconductor device as claimed in claim 1 , wherein the semiconductor device is a semiconductor memory device.

18. A method of writing data comprising the steps of:

writing data into memory cells via a write data bus;

reading data from the memory cells via a read data bus; and

writing data into the memory cells via the read data bus at the time of given writing.

19. The method as claimed in claim 18 , further comprising the step of

writing data into the memory cells via the write data bus at the time of given writing.

20. The method as claimed in claim 18 , further comprising the step of

writing, at the time of given writing, data into the memory cells via shield lines that shield the read data bus.

21. The method as claimed in claim 18 , further comprising the step of

reading verified data from the memory cells via the read data bus.

22. The method as claimed in claim 18 , further comprising the step of

reading verified data from the memory cells via the write data bus.

23. The method as claimed in claim 20 , further comprising the step of

reading verified data from the memory cells via the shield lines.

24. The method as claimed in claim 18 , further comprising the step of

generating a select signal that selects one of banks that have the memory cells.

25. The method as claimed in claim 18 , further comprising the step of

reading data from a second one of banks while writing data into a first one of the banks.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
RELEASE OF SECURITY INTEREST Recorded Dec 22, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 044949/0962 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2017
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 044938/0360 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036036/0738 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2005
From: KUROSAKI, KAZUHIDE
To: SPANSION LLC
Reel/Frame 017008/0564 →