Integrated circuit package system

1. An integrated circuit package method comprising:

forming a leadframe structure having an encapsulant space provided predominantly inside the leadframe structure wherein forming the leadframe structure comprises:

providing a first leadframe having a planar top surface,

providing a second leadframe around the encapsulant space and having a planar bottom surface, and

stacking the second leadframe on the first leadframe; and

attaching a die over and to the leadframe structure in the encapsulant space inside the leadframe structure;

electrically connecting the die to the leadframe structure; and

injecting encapsulant into the encapsulant space to form an integrated circuit package system wherein:

injecting the encapsulant injects the encapsulant to have a top surface coplanar with the planar top surface and a bottom surface coplanar with the planar bottom surface.

2. The method of claim 1 further comprising positioning a heat sink over or under the die before injecting the encapsulant.

3. The method of claim 1 further comprising positioning posts or columns around the die before injecting the encapsulant.

4. The method of claim 1 wherein forming the leadframe structure forms the leadframe structure with undercut sides.

5. The method of claim 1 further comprising:

providing a further leadframe having a further die electrically connected thereto; and

mounting the further leadframe on the leadframe structure before injecting the encapsulant.

6. The method of claim 1 wherein forming the leadframe structure includes forming a center thinner than the perimeter or forming a trench therein for attaching the die.

7. The method of claim 1 further comprising:

manufacturing a second integrated circuit package system; and

stacking the second integrated circuit package system on the integrated circuit package system.

8. The method of claim 1 further comprising mounting additional electrical components inside the leadframe structure.

9. An integrated circuit package method comprising:

providing two mold halves;

forming a leadframe structure having an encapsulant space provided predominantly inside the leadframe structure formed by the two mold halves and the leadframe structure wherein forming the leadframe structure comprises:

providing a first leadframe defining the encapsulant space and having a planar top surface,

providing a second leadframe having a planar bottom surface, and

stacking the second leadframe on the first leadframe;

providing the two mold halves provides the two mold halves with flat surfaces clampable to the planar top surface and the planar bottom surface;

attaching a die to and over the leadframe structure in the encapsulant space inside the leadframe structure;

electrically connecting the die to the leadframe structure using wire bonding, low loop wire bonding ball bonding, solder bonding, or a combination thereof; and

injecting encapsulant into the encapsulant space with the two mold halves clamped against the leadframe structure to form an integrated circuit package system wherein injecting the encapsulant injects the encapsulant to have a top surface coplanar with the planar top surface and a bottom surface coplanar with the planar bottom surface.

10. The method of claim 9 further comprising positioning a heat sink using posts or adhesive over or under the die before injecting the encapsulant.

11. The method of claim 9 further comprising positioning posts and a top frame or columns around the die before injecting the encapsulant.

12. The method of claim 9 wherein forming the leadframe structure forms the leadframe structure with undercut sides adjacent singulation areas of the integrated circuit package system.

13. The method of claim 9 further comprising:

providing a further leadframe having a further die electrically connected thereto; and

mounting the further leadframe in a flipped position on the leadframe structure before injecting the encapsulant.

14. The method of claim 9 wherein forming the leadframe structure includes forming a center thinner than the perimeter or forming a trench therein for attaching the die.

15. The method of claim 9 further comprising:

manufacturing a second integrated circuit package system;

stacking the second integrated circuit package system on the integrated circuit package system; and

electrically connecting the second integrated circuit package system to the integrated circuit package system.

16. The method of claim 9 further comprising mounting additional active and passive electrical components on and inside the leadframe structure.

17. An integrated circuit package system comprising:

a leadframe structure having an encapsulant space provided predominantly inside the leadframe wherein the leadframe structure comprises:

a first leadframe having a planar top surface, and

a second leadframe around the encapsulant space and having a planar bottom surface, the second leadframe stacked on the first leadframe;

a die bonded over and electrically connected to the leadframe structure in the encapsulant space inside the leadframe structure; and

encapsulant in the encapsulant space to form the integrated circuit package system, the encapsulant having a top surface coplanar with the planar top surface and a bottom surface coplanar with the planar bottom surface.

18. The system of claim 17 further comprising a heat sink over or under the die in contact with the encapsulant.

19. The system of claim 17 further comprising posts or columns around the die in the encapsulant.

20. The system of claim 17 wherein the leadframe structure has undercut sides.

21. The system of claim 17 further comprising:

a further leadframe having a further die electrically connected thereto; and

the further leadframe on the leadframe structure bonded by the encapsulant.

22. The system of claim 17 wherein the leadframe structure includes a center thinner than the perimeter or forming a trench therein for attaching the die.

23. The system of claim 17 further comprising:

a second integrated circuit package system; and

the second integrated circuit package system stacked on the integrated circuit package system.

24. The system of claim 17 further comprising additional electrical components inside the leadframe structure.

25. An integrated circuit package system comprising:

a leadframe structure having an encapsulant space provided predominantly inside the leadframe structure wherein the leadframe structure comprises:

a first leadframe defining the encapsulant space and having a planar top surface, and

a second leadframe having a planar bottom surface, the second leadframe stacked on the first leadframe;

a die attached over and electrically connected to the leadframe structure in the encapsulant space inside the leadframe structure by wire bonding, low loop wire bonding ball bonding, solder bonding, or a combination thereof; and

an encapsulant in the encapsulant space to form the integrated circuit package system, the encapsulant having a top surface coplanar with the planar top surface and a bottom surface coplanar with the planar bottom surface.

26. The system of claim 25 further comprising a heat sink having posts or adhesive over or under the die before injecting the encapsulant.

27. The system of claim 25 further comprising posts and a top frame or columns around the die in the encapsulant.

28. The system of claim 25 wherein the leadframe structure has undercut sides adjacent singulation areas of the integrated circuit package system.

29. The system of claim 25 further comprising:

a further leadframe having a further die electrically connected thereto and the further leadframe in a flipped position on the leadframe structure in the encapsulant.

30. The system of claim 25 wherein the leadframe structure includes a center thinner than the perimeter or a trench having the die attached.

31. The system of claim 25 further comprising:

a second integrated circuit package system; and

the second integrated circuit package system stacked on the integrated circuit package system, and the second integrated circuit package system electrically connected to the integrated circuit package system.

32. The system of claim 25 further comprising additional active and passive electrical components on and inside the leadframe structure.