Integrated circuit package system having interconnect stack and external interconnect

1. A method of manufacturing an integrated circuit package system comprising:

forming an integrated circuit die having a first bond pad provided thereon;

forming an interconnect stack having a wire stitch directly on a first external interconnect and a ball bond directly on the wire stitch, the interconnect stack having an equal number of wire stitches and ball bonds with one of the ball bonds as a topmost part of the interconnect stack;

connecting the interconnect stack to the first bond pad; and

forming an encapsulation covering the integrated circuit die, the interconnect stack, and the first external interconnect with the first external interconnect exposed from the encapsulation.

2. The method as claimed in claim 1 wherein forming the interconnect stack comprises:

attaching a first interconnect on the first external interconnect;

forming a first ball bond on the first interconnect;

attaching a second interconnect on the first ball bond; and

forming a second ball bond on the second interconnect.

3. The method as claimed in claim 1 further comprising connecting the interconnect stack to a group of first bond pads of the integrated circuit die.

4. The method as claimed in claim 1 further comprising connecting an interconnect between a second external interconnect and a second bond pad of the integrated circuit die.

5. The method as claimed in claim 1 further comprising attaching the integrated circuit die on a die paddle adjacent to the first external interconnect.

6. A method of manufacturing an integrated circuit package system comprising:

forming an integrated circuit die having a first bond pad provided thereon;

forming a interconnect stack having a wire stitch directly on a first lead and a ball bond directly on the wire stitch, the interconnect stack having an equal number of wire stitches and ball bonds with one of the ball bonds as a topmost part of the interconnect stack;

connecting the interconnect stack on a first bond pad; and

forming an encapsulation covering the integrated circuit die, the interconnect stack, and the first lead with the first lead exposed from the encapsulation.

7. The method as claimed in claim 6 wherein forming the interconnect stack comprises:

attaching a first wire stitch on the first lead;

forming a first ball bond on the first wire stitch;

attaching a second wire stitch on the first ball bond; and

forming a second ball bond on the second wire stitch.

8. The method as claimed in claim 6 further comprising connecting an interconnect between a second lead and a second bond pad of the integrated circuit die.

9. The method as claimed in claim 6 further comprising forming first bond pads of the integrated circuit die is in a configuration of an array.

10. The method as claimed in claim 6 further comprising forming first bond pads of the integrated circuit die is at a boundary of the integrated circuit die.

11. An integrated circuit package system comprising:

an integrated circuit die having a first bond pad provided thereon;

an interconnect stack having a wire stitch directly on a first external interconnect and a ball bond directly on the wire stitch, the interconnect stack connected to the first bond pad, the interconnect stack having an equal number of wire stitches and ball bonds with one of the ball bonds as a topmost part of the interconnect stack; and

an encapsulation covering the integrated circuit die, the interconnect stack, and the first external interconnect with the first external interconnect exposed from the encapsulation.

12. The system as claimed in claim 11 wherein the interconnect stack comprises:

a first interconnect on the first external interconnect;

a first ball bond on the first interconnect;

a second interconnect on the first ball bond; and

a second ball bond on the second interconnect.

13. The system as claimed in claim 11 further comprising the interconnect stack connected to a group of first bond pads of the integrated circuit die.

14. The system as claimed in claim 11 further comprising an interconnect between a second external interconnect and a second bond pad of the integrated circuit die.

15. The system as claimed in claim 11 further comprising the integrated circuit die on a die paddle adjacent to the first external interconnect.

16. The system as claimed in claim 11 wherein:

the integrated circuit die having the first bond pad provided thereon has an active side;

the interconnect stack on the first external interconnect, the interconnect stack connected to the first bond pad has a wire; and

the first external interconnect is a first lead.

17. The system as claimed in claim 16 wherein the interconnect stack comprises:

a first wire stitch on the first lead;

a first ball bond on the first wire stitch;

a second wire stitch on the first ball bond; and

a second ball bond on the second wire stitch.

18. The system as claimed in claim 16 further comprising an interconnect between a second lead and a second bond pad of the integrated circuit die.

19. The system as claimed in claim 16 further comprising first bond pads of the integrated circuit die is in a configuration of an array.

20. The system as claimed in claim 16 further comprising first bond pads of the integrated circuit die is at a boundary of the integrated circuit die.