Integrated circuit package system
View Patent ↗An integrated circuit package system is provided providing a first structure, forming a compression via in the first structure, forming a stud bump on a second structure and pressing the stud bump into the compression via forming a mechanical bond.
1. A method of making an integrated circuit package system comprising:
providing a first structure;
forming a compression via in the first structure;
forming a stud bump on a second structure; and
pressing the stud bump into the compression via forming a mechanical bond.
2. The method as claimed in claim 1 further comprising adjusting a stand-off height between the first structure and the second structure.
3. The method as claimed in claim 1 wherein forming the via forms an elongated via.
4. The method as claimed in claim 1 wherein providing the first structure provides a leadframe lead and providing the second structure provides an integrated circuit die.
5. The method as claimed in claim 1 further comprising:
forming a second stud bump on the first structure;
forming a third structure having a further compression via; and
wherein:
mounting the first structure includes:
mounting the first structure on the third structure, and
pressing the second stud bump into the further compression via to form a mechanical bond;
providing the first structure provides a tape substrate;
providing the second structure provides an integrated circuit die; and
providing the third structure provides a laminate substrate.
6. A method of making an integrated circuit package system comprising:
providing a first structure;
forming a compression via in the first structure by etching a diameter of the compression via;
forming a stud bump on a second structure further comprises forming a conical shape; and
forming a mechanical bond by pressing the stud bump into the compression via, forming a metal deformation region in the stud bump.
7. The method as claimed in claim 6 further comprising adjusting a stand-off height between the first structure and the second structure comprising setting a distance, from the second structure, where the diameter of the stud bump exceeds the diameter of the compression via.
8. The method as claimed in claim 6 wherein forming the via comprises forming an elongated via by punching, stamping, laser cutting, or a combination thereof.
9. The method as claimed in claim 6 wherein providing the first structure provides a leadframe lead and providing the second structure provides an integrated circuit.
10. The method as claimed in claim 6 further comprising:
forming a second stud bump on a conductive layer of the first structure;
forming a third structure including etching a further compression via in a signal layer of the third structure comprises forming the further compression via therein; and
wherein:
mounting the first structure includes:
mounting the first structure on the third structure, and
pressing the second stud bump into the further compression via to form a mechanical bond;
providing the first structure provides a tape substrate;
providing the second structure provides an integrated circuit die; and
providing the third structure provides a laminate substrate.
11. An integrated circuit package system comprising:
a first structure;
a compression via formed in the first structure;
a stud bump formed on an second structure; and
a mechanical bond formed by the stud bump having an interference fit with the compression via.
12. The system as claimed in claim 11 further comprising a stand-off height between the first structure and the second structure.
13. The system as claimed in claim 11 wherein the via forms an elongated via.
14. The system as claimed in claim 11 wherein the first structure provides a leadframe lead and the second structure provides an integrated circuit die.
15. The system as claimed in claim 11 further comprises:
a second stud bump formed on the first structure;
a signal layer, in a third structure, having a further compression via formed therein; and
wherein:
the first structure mounted includes:
the first structure mounted on the third structure, and
a mechanical bond formed by the second stud bump having an interference fit with the further compression via;
the first structure provides a tape substrate;
the second structure provides an integrated circuit die; and
the third structure provides a laminate substrate.
16. The system as claimed in claim 11 wherein:
an etched dimension in the via;
a conical shape forms the stud bump; and
a metal deformation region in the stud bump comprises the mechanical bond.
17. The system as claimed in claim 16 further comprising a stand-off height between the first structure and the second structure, a distance, from the second structure, based on where the diameter of the stud bump exceeds the diameter of the via.
18. The system as claimed in claim 16 wherein the via comprises an elongated via.
19. The system as claimed in claim 16 wherein the first structure provides a leadframe lead, having an inner lead that is half etched and the second structure provides an integrated circuit die.
20. The system as claimed in claim 16 further comprising:
a conductive layer in the first structure with a second stud bump, having a conical shape, formed thereon;
a signal layer, of a third structure, having the further compression via therein; and
wherein:
the first structure mounted includes:
the first structure mounted on the third structure,
a mechanical bond formed by the second stud bump having an interference fit with the further compression via, the metal deformation region in the second stud bump;
the first structure provides a tape substrate;
the second structure provides an integrated circuit die; and
the third structure provides a laminate substrate.