Integrated circuit package system with ground ring
View Patent ↗An integrated circuit package system is provided forming a ring above a paddle and an external interconnect, mounting an integrated circuit die on the paddle, connecting the integrated circuit die and the external interconnect, the external interconnect and the ring, and the ring and the integrated circuit die, and encapsulating the integrated circuit die, the ring, and a portion of the external interconnect and the paddle.
1. A method of manufacture of an integrated circuit package system comprising:
forming a ring with a ring elevation above a paddle and above an external interconnect forming paddle-ring and ring-interconnect gaps of substantially zero between the ring and the paddle, and the ring and the external interconnect, respectively;
mounting an integrated circuit die on the paddle;
connecting the integrated circuit die and the external interconnect, the external interconnect and the ring, and the ring and the integrated circuit die; and
encapsulating the integrated circuit die, the ring, and a portion of the external interconnect and the paddle.
2. The method as claimed in claim 1 wherein forming the ring above the paddle and the external interconnect includes forming a paddle-ring gap between a paddle edge and a ring inner side.
3. The method as claimed in claim 1 wherein forming the ring above the paddle and the external interconnect includes forming a paddle-ring bend between a paddle edge and a ring inner side.
4. The method as claimed in claim 1 wherein forming the ring above the paddle and the external interconnect comprises:
punching a lead frame to form an elevated region; and
chemically etching the lead frame to form the ring with the elevated region, the paddle, a paddle-ring gap between a paddle edge and a ring inner side, and the external interconnect.
5. The method as claimed in claim 1 wherein forming the ring above the paddle and the external interconnect comprises:
etching a lead frame to form the external interconnect and the paddle; and
punching the paddle at the boundary to form the ring.
6. A method of manufacture of an integrated circuit package system comprising:
forming a ground ring with a ring elevation above a paddle and above an external interconnect forming paddle-ring and ring-interconnect gaps of substantially zero between the ring and the paddle, and the ring and the external interconnect, respectively;
mounting an integrated circuit die on the paddle with an adhesive;
electrically connecting the integrated circuit die and the external interconnect, the external interconnect and the ground ring, and the ground ring and the integrated circuit die; and
encapsulating the integrated circuit die, the ring, and a portion of the external interconnect and the paddle.
7. The method as claimed in claim 6 further comprising forming a tie bar to support the ring and the paddle.
8. The method as claimed in claim 6 wherein forming the ground ring above the paddle and the external interconnect includes forming a mold lock with the ground ring.
9. The method as claimed in claim 6 wherein the encapsulating includes exposing a paddle bottom surface.
10. The method as claimed in claim 6 further comprising plating silver on the ground ring.
11. An integrated circuit package system comprising:
a ring with a ring elevation above a paddle and above an external interconnect having paddle-ring and ring-interconnect gaps of substantially zero between the ring and the paddle, and the ring and the external interconnect, respectively;
an integrated circuit die on the paddle;
an interconnect between the integrated circuit die and the external interconnect, between the external interconnect and the ring, and between the ring and the integrated circuit die; and
an encapsulation to cover the integrated circuit die, the ring, the interconnect, and a portion of the external interconnect and the paddle.
12. The system as claimed in claim 11 wherein the ring above the paddle and the external interconnect includes a paddle-ring gap between a paddle edge and a ring inner side.
13. The system as claimed in claim 11 wherein the ring above the paddle and the external interconnect includes a paddle-ring bend between a paddle edge and a ring inner side.
14. The system as claimed in claim 11 wherein the ring above the paddle and the external interconnect comprises:
an elevated region of the paddle, the ring formed from the elevated region; and
a paddle-ring gap between a paddle edge and a ring inner side.
15. The system as claimed in claim 11 wherein forming the ring above the paddle and the external interconnect includes a ring-interconnect gap between the ring and the external interconnect.
16. The system as claimed in claim 11 wherein:
the ring above the paddle and the external interconnect is a ground ring;
the integrated circuit die is on the paddle with an adhesive;
the interconnect between the integrated circuit die and the external interconnect, between the external interconnect and the ring, between the ring connected to the integrated circuit die is a bond wire; and
the encapsulation to cover the integrated circuit die, the ring, the interconnect, and a portion of the external interconnect and the paddle exposes an external interconnect bottom surface.
17. The system as claimed in claim 16 further comprising a tie bar to support the ring and the paddle.
18. The system as claimed in claim 16 wherein the ground ring above the paddle and the external interconnect is a mold lock.
19. The system as claimed in claim 16 wherein the encapsulation exposes a paddle bottom surface.
20. The system as claimed in claim 16 further comprising silver plated on the ground ring.