Patent Assignment
Reel/Frame 067534/0872
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC LTD. AND CORRECT THE NAME OF RECEIVING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 64838 FRAME: 948. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME.
Recorded: 2024-05-29
Received: 2024-05-29
Pages: 11
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, SINGAPORE
Covered Applications
(13)
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM AND METHOD OF MANUFACTURE THEREOF
App. No. 12/409,491
→
INTEGRATED CIRCUIT UNDERFILL PACKAGE SYSTEM
App. No. 12/336,141
→
SOLDER JOINT FLIP CHIP INTERCONNECTION HAVING RELIEF STRUCTURE
App. No. 11/640,534
→
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ARCHED PEDESTAL
App. No. 11/463,855
→
LEADED STACKED PACKAGES HAVING INTEGRATED UPPER LEAD
App. No. 11/459,568
→
INTEGRATED CIRCUIT LEADLESS PACKAGE SYSTEM
App. No. 11/459,320
→
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EDGE CONNECTION SYSTEM
App. No. 11/421,051
→
OFFSET INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
App. No. 11/383,407
→
MULTICHIP PACKAGE SYSTEM
App. No. 11/278,418
→
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH GROUND RING
App. No. 11/277,991
→
STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM
App. No. 11/307,906
→
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING
App. No. 11/306,854
→
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH IMAGE SENSOR SYSTEM
App. No. 11/326,206
→