Integrated circuit package system with arched pedestal

1. An integrated circuit package system comprising:

forming an arched pedestal integrated circuit die including:

forming an active surface;

providing a die mounting surface;

forming a pedestal portion including:

forming an arch intersecting the die mounting surface and having an arch height; and

forming the arch under a portion of the active surface and having an arch width less than the arch height.

2. The system as claimed in claim 1 wherein forming the arched pedestal integrated circuit die includes forming a second, third, or fourth arch.

3. The system as claimed in claim 1 further comprising:

providing a base integrated circuit die; and

wherein forming the arched pedestal integrated circuit die includes:

forming the pedestal portion smaller than the base integrated circuit die.

4. The system as claimed in claim 1 further comprising attaching electrical connectors between a package substrate and a base integrated circuit die, between the package substrate and the arched pedestal integrated circuit die, and filling an encapsulant between the arch and the electrical connectors.

5. The system as claimed in claim 1 further comprising:

providing an integrated circuit wafer;

applying a singulation apparatus for one-step arch-formation and singulation of the arched pedestal integrated circuit die from the integrated circuit wafer.

6. An integrated circuit package system comprising:

forming an arched pedestal integrated circuit die including:

forming an active surface and forming arched pedestal die pads adjacent at least one edge thereof;

providing a die mounting surface on the opposite side of the die from the active surface;

forming a pedestal portion including:

forming an arch intersecting the die mounting surface and having an arch height;

forming the arch under a portion of the active surface and having an arch width less than the arch height; and

forming an overhang edge adjacent the portion of the arch adjacent the active surface.

7. The system as claimed in claim 6 wherein forming the arched pedestal integrated circuit die includes forming a second, third, or fourth arch with a ratio between the arch height and the arch width of at least six to four.

8. The system as claimed in claim 6 further comprising:

providing a base integrated circuit die;

attaching the die mounting surface of the arched pedestal integrated circuit die over the base integrated circuit die; and

wherein forming the arched pedestal integrated circuit die includes:

forming the pedestal portion smaller than the active surface of the arched pedestal integrated circuit die and smaller than the base integrated circuit die.

9. The system as claimed in claim 6 further comprising attaching electrical connectors between a package substrate and a base integrated circuit die, between the package substrate and the arched pedestal integrated circuit die, and wherein the arch guides an encapsulant around the electrical connectors.

10. The system as claimed in claim 6 further comprising:

providing an integrated circuit wafer;

applying a singulation apparatus having a rectangular blade and an arch blade with an elliptical or circular shape for one-step arch-formation and singulation of the arched pedestal integrated circuit die from the integrated circuit wafer.

11. An integrated circuit package system comprising:

an arched pedestal integrated circuit die including:

an active surface;

a die mounting surface;

a pedestal portion including:

an arch intersecting the die mounting surface and having an arch height; and

the arch under a portion of the active surface and having an arch width less than the arch height.

12. The system as claimed in claim 11 wherein the arched pedestal integrated circuit die includes a second, third, or fourth arch.

13. The system as claimed in claim 11 further comprising a base integrated circuit and wherein the pedestal portion is smaller than the base integrated circuit die.

14. The system as claimed in claim 11 further comprising electrical connectors between a package substrate and a base integrated circuit die, between the package substrate and the arched pedestal integrated circuit die, and an encapsulant between the arch and the electrical connectors.

15. The system as claimed in claim 11 further comprising an overhang edge adjacent the portion of the arch adjacent the active surface.

16. The system as claimed in claim 11 wherein:

the arched pedestal integrated circuit die includes:

the active surface with arched pedestal die pads adjacent at least one edge thereof;

the die mounting surface on the opposite side of the die from the active surface;

the pedestal portion including:

the arch intersecting the die mounting surface and having the arch height, and

the arch under a portion of the active surface and having the arch width less than the arch height, and

further comprising:

an overhang edge adjacent the portion of the arch adjacent the active surface.

17. The system as claimed in claim 16 wherein the arched pedestal integrated circuit die includes a second, third, or fourth arch with a ratio between the arch height and the arch width of at least six to four.

18. The system as claimed in claim 16 further comprising:

a base integrated circuit die; and

the die mounting surface of the arched pedestal integrated circuit die over the base integrated circuit die; and

wherein the arched pedestal integrated circuit die includes:

the pedestal portion smaller than the active surface of the arched pedestal integrated circuit die and smaller than the base integrated circuit die.

19. The system as claimed in claim 16 further comprising electrical connectors between a package substrate and a base integrated circuit die, between the package substrate and the arched pedestal integrated circuit die, and wherein the arch for guiding an encapsulant around the electrical connectors.

20. The system as claimed in claim 16 wherein the overhang edge adjacent the portion of the arch adjacent the active surface, includes a rectangular shape.