Integrated circuit package system with heatspreader

1. A method for manufacturing an integrated circuit package system comprising:

providing a substrate;

attaching an integrated circuit to the substrate;

applying a tape on the integrated circuit;

attaching an attachment material to the tape;

attaching a heatspreader to the attachment material and directly to the substrate, the heatspreader having a force control protrusion with a recessed center area for redistribution of assembly forces, the force control protrusion directly over only the substrate; and

forming an encapsulant over the heatspreader and the integrated circuit with the recessed center area exposed from the encapsulant.

2. The method as claimed in claim 1 wherein attaching the heatspreader includes forming the heatspreader having a support post at a predetermined distance from the integrated circuit.

3. The method as claimed in claim 1 wherein attaching the heatspreader includes forming a mold seal surface with a predetermined size adjacent to the force control protrusion.

4. The method as claimed in claim 1 wherein attaching the heatspreader includes forming the force control protrusion substantially adjacent to a support post.

5. The method as claimed in claim 1 wherein attaching the heatspreader includes attaching a base link surface of the heatspreader to the substrate.

6. A method for manufacturing an integrated circuit package system comprising:

forming a substrate having a first surface;

attaching an integrated circuit to the substrate;

applying a tape on the integrated circuit;

attaching an attachment material to the tape;

attaching a heatspreader to the attachment material and directly on the first surface, the heatspreader having a force control protrusion with a recessed center area for redistribution of assembly forces, the force control protrusion directly over only the substrate; and

molding an encapsulant over the heatspreader and the integrated circuit with the recessed center area and the force control protrusion substantially exposed from the encapsulant.

7. The method as claimed in claim 6 wherein attaching the heatspreader includes a mold seal surface partially over a support post and adjacent to the force control protrusion.

8. The method as claimed in claim 6 wherein attaching the heatspreader includes forming the force control protrusion at a predetermined distance from the integrated circuit.

9. The method as claimed in claim 6 wherein attaching the heatspreader includes applying the attachment material between the heatspreader and the integrated circuit.

10. The method as claimed in claim 6 wherein attaching the heatspreader includes applying the attachment material between the heatspreader and the tape on the integrated circuit.

11. An integrated circuit package system comprising:

a substrate;

an integrated circuit attached to the substrate;

a tape on the integrated circuit;

an attachment material attached to the tape;

a heatspreader attached to the attachment material and directly to the substrate, the heatspreader having a force control protrusion with a recessed center area for redistribution of assembly forces, the force control protrusion directly over only the substrate; and

an encapsulant over the heatspreader and the integrated circuit with the recessed center area exposed from the encapsulant.

12. The system as claimed in claim 11 wherein the heatspreader includes the heatspreader having a support post at a predetermined distance from the integrated circuit.

13. The system as claimed in claim 11 wherein the heatspreader includes a mold seal surface with a predetermined size adjacent to the force control protrusion.

14. The system as claimed in claim 11 wherein the heatspreader includes the force control protrusion substantially adjacent to a support post.

15. The system as claimed in claim 11 wherein the heatspreader includes a base link surface attached to the substrate.

16. The system as claimed in claim 11 wherein:

the substrate having a first surface and the integrated circuit thereon;

the heatspreader having the force control protrusion over the first surface of the substrate for redistribution of the assembly forces; and

the encapsulant over the heatspreader and the integrated circuit with the force control protrusion substantially exposed.

17. The system as claimed in claim 16 wherein the heatspreader includes a mold seal surface partially over a support post and adjacent to the force control protrusion.

18. The system as claimed in claim 16 wherein the heatspreader includes the force control protrusion at a predetermined distance from the integrated circuit.

19. The system as claimed in claim 16 further comprising the attachment material between the heatspreader and the integrated circuit.

20. The system as claimed in claim 16 further comprising the attachment material between the heatspreader and the tape on the integrated circuit.