IP Library Granted Patent US 7,362,131
Granted Patent B2
US 7,362,131 · App. 11/279,046 · Granted Apr 22, 2008

Integrated circuit including programmable logic and external-device chip-enable override control

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Quick Facts
Patent No.
US 7,362,131
App. No.
11/279,046
Filed
Apr 7, 2006
Granted
Apr 22, 2008
Kind
B2
Examiner
TAN, VIBOL
Art Unit
2819
USPC
326/38
Abstract

An integrated circuit device includes a programmable logic block, a monitoring input, a condition-sensing circuit coupled to the monitoring input and configured to generate a condition-sensed signal at an output in response to sensing a condition at the monitoring input, a first digital input, a first digital output, and a gating circuit configured in the programmable logic block and coupled between the first digital input and the first digital output. The gating circuit has a gating input coupled to the condition-sensing circuit and generates an output. The output is related to an input state of the first digital input in the absence of the condition-sensed signal and assumes an override state in the presence of the condition-sensed signal.

Claims (32)

1. A programmable system-on-a-chip integrated circuit device comprising:

a programmable logic block

a digital input/output circuit block;

a non-volatile memory block;

an analog circuit block including an analog-to-digital converter, at least one temperature-sensing circuit coupled to an I/O pad, the temperature-sensing circuit including a programmable voltage prescaling circuit;

an analog input/output circuit block;

a clock generator circuit and distribution block including at least one RC oscillator, a crystal oscillator circuit coupled to I/O pads for coupling to an external crystal, at least one phase locked loop circuit, at least one I/O pad for coupling to an external clock source; and

a programmable interconnect architecture including programmable elements and interconnect conductors, ones of said programmable elements coupled to said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, said digital input/output circuit block, and to said interconnect conductors, such that inputs and outputs of said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, and said digital input/output circuit block can be programmably coupled to one another.

2. The programmable system-on-a-chip integrated circuit device of claim 1 further including a static random-access memory block and wherein said programmable interconnect architecture is coupled to said static random-access memory block.

3. The programmable system-on-a-chip integrated circuit device of claim 2 wherein said static random-access memory block is configured into at least two sub-blocks.

4. The programmable system-on-a-chip integrated circuit device of claim 1 further including a microcontroller block and a static random-access memory block and wherein said programmable interconnect architecture is coupled to said microcontroller block and said static random-access memory block.

5. The programmable system-on-a-chip integrated circuit device of claim 4 wherein said static random-access memory block is configured into at least two sub-blocks.

6. The programmable system-on-a-chip integrated circuit device of claim 1 further including a microprocessor block and a static random-access memory block and wherein said programmable interconnect architecture is coupled to said microprocessor block and said static random-access memory block.

7. The programmable system-on-a-chip integrated circuit device of claim 6 wherein said static random-access memory block is configured into at least two sub-blocks.

8. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said non-volatile memory block comprises flash memory.

9. The programmable system-on-a-chip integrated circuit device of claim 1 further including a digital input circuit coupled to said I/O pad.

10. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said analog circuit block further includes at least one voltage-sensing circuit coupled to an I/O pad.

11. The programmable system-on-a-chip integrated circuit device of claim 10 wherein said at least one voltage-sensing circuit includes a programmable voltage prescaling circuit.

12. The programmable system-on-a-chip integrated circuit device of claim 10 further including a digital input circuit coupled to said I/O pad.

13. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said analog circuit block further includes at least one current-sensing circuit coupled to a first I/O pad and a second I/O pad.

14. The programmable system-on-a-chip integrated circuit device of claim 13 wherein said at least one current-sensing circuit includes a programmable voltage prescaling circuit.

15. The programmable system-on-a-chip integrated circuit device of claim 13 further including a digital input circuit coupled to at least one of said first and second I/O pads.

16. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said analog circuit block further includes at least one programmable MOSFET gate-drive circuit coupled to an I/O pad.

17. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said analog circuit block further includes:

at least one MOSFET gate-drive circuit coupled to a first I/O pad,

at least one voltage-sensing circuit coupled to a second I/O pad;

at least one current-sensing circuit coupled to said second I/O pad and a third I/O pad; and

at least one temperature-sensing circuit coupled to a fourth I/O pad.

18. The programmable system-on-a-chip integrated circuit device of claim 17 further including a digital input circuit coupled to one of said second, third, and fourth I/O pads.

19. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said non-volatile memory block has a first segment that may be programmably connected to a user-configured circuit and a second segment that may not be programmably connected to a user-configured circuit.

20. The programmable system-on-a-chip integrated circuit device of claim 1 further including a bandgap reference circuit.

21. The programmable system-on-a-chip integrated circuit device of claim 1 further including a glitchless clock multiplexer coupled between at least two of the at least one RC oscillator, the crystal oscillator circuit coupled to I/O pads for coupling to an external crystal, the at least one phase locked loop circuit, and the at least one I/O pad for coupling to an external clock source.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0572 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →