Integrated circuit underfill package system

1. An integrated circuit underfill package system comprising:

providing a substrate having a dispense port;

attaching a first integrated circuit die on the substrate; and

supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted so that the substrate is positioned above the first integrated circuit die to substantially fill a region between the substrate and the first integrated circuit and only spread on a sidewall of the first integrated circuit die.

2. The system as claimed in claim 1 further comprising:

attaching a second integrated circuit die over the first integrated circuit die; and

supplying the underfill does not fill a space between the second integrated circuit die and the substrate.

3. The system as claimed in claim 1 further comprising:

attaching a second integrated circuit die over the first integrated circuit die; and

supplying the underfill fills a space between the second integrated circuit die and the substrate.

4. The system as claimed in claim 1 wherein supplying the underfill comprises spreading an overflow of the underfill on a sidewall of the first integrated circuit die.

5. The system as claimed in claim 1 wherein:

providing the first integrated circuit comprises providing electrical connectors between the first integrated circuit and the substrate; and

the underfill encapsulates the electrical connectors.

6. An integrated circuit underfill package system comprising:

forming a substrate having a dispense port, first electrical connections, and second electrical connections;

mounting a first integrated circuit die having first electrical connectors on the substrate;

dispensing an underfill to the dispense port and between the substrate and the first integrated circuit die when the substrate and the first integrated circuit die are inverted so that the substrate is positioned above the first integrated circuit die; and

curing the underfill between the substrate and the first integrated circuit die, and only on a sidewall of the first integrated circuit die.

7. The system as claimed in claim 6 wherein forming the substrate comprises:

forming a mounting surface with the first electrical connections and the second electrical connections;

forming an interconnect surface for electrical interconnects; and

encapsulating the first electrical connections in the underfill and the second electrical connections in an encapsulant.

8. The system as claimed in claim 6 wherein:

mounting the first integrated circuit die comprises mounting a flipchip having solder bumps to the first electrical connections.

9. The system as claimed in claim 6 wherein dispensing the underfill comprises:

dispensing a controlled quantity of the underfill to minimize overflow of the underfill to a predetermined space between the first integrated circuit die and second electrical connections and on a sidewall of the first integrated circuit die when the substrate is inverted.

10. The system as claimed in claim 6 wherein curing the underfill comprises:

curing a controlled quantity of the underfill between the first integrated circuit die and the second electrical connections and on a sidewall of the first integrated circuit die.