Integrated circuit packaging system including a non-leaded package
An integrated circuit package system is provided including: forming a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; configuring each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and forming the second terminal ends of alternating leads disposed along the periphery of the package to form an etched lead-to-lead gap in excess of the predetermined interval gap.
1. A method of manufacture of an integrated circuit package comprising:
forming a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads as a dual row quad flat non-leaded package or a single row quad flat non-leaded package; configuring each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and forming the second terminal ends of alternating leads disposed along the periphery of the package to form a half-etched lead-to-lead gap in excess of the predetermined interval gap, wherein the half-etched lead-to-lead gap is formed after forming the plurality of leads with the predetermined thickness and the predetermined interval gap.
2. The method as claimed in claim 1 wherein:
forming the second terminal ends for preventing interval gap lead-to-lead shorting.
3. The method as claimed in claim 1 wherein:
forming the second terminal ends includes partial half-etching the second terminal ends of the alternating leads to form a projection with or without an angled base.
4. The method as claimed in claim 1 wherein:
forming the second terminal ends includes partial half-etching all of the second terminal ends to form a projection with or without an angled base.
5. A method of manufacture of an integrated circuit package comprising:
forming an electrically conductive layer; masking the electrically conductive layer to form a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; forming each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along the periphery of a package; defining an amount to be removed from the second terminal ends of alternating leads for preventing interval gap lead shortage; masking the second terminal ends of the alternating leads; and etching the second terminal ends of the alternating leads to form a half-etched lead-to-lead gap between adjacent leads at the second terminal ends in excess of the predetermined interval gap, wherein the half-etched lead-to-lead gap is formed after forming the plurality of leads with the predetermined thickness and the predetermined interval gap.
6. The method as claimed in claim 5 wherein:
masking the electrically conductive layer or masking the second terminal ends of the alternating leads can be done with either a negative photoresist or positive photoresist.
7. The method as claimed in claim 5 wherein:
etching the second terminal ends of the alternating leads employs either an isotropic or anisotropic etchant.
8. The method as claimed in claim 5 wherein:
etching includes half-etching the second terminal ends of the alternating leads.
9. The method as claimed in claim 5 wherein:
etching includes half-etching all of the second terminal ends.