Stackable integrated circuit package system with multiple interconnect interface

1. A stackable integrated circuit package system comprising:

forming a first integrated circuit die having an interconnect provided thereon wherein forming the first integrated circuit die having the interconnect provided thereon comprises forming a distribution with interconnects in a configuration of an array distribution, a peripheral distribution, a partially depopulated distribution, a multiple pitch distribution, or a combination thereof;

forming an external interconnect, having an upper tip and a lower tip, from a lead frame;

mounting the first integrated circuit die on the external interconnect with the interconnect on the lower tip and below the upper tip; and

encapsulating around the interconnect with an exposed surface.

2. The system as claimed in claim 1 wherein the encapsulating comprises encapsulating the interconnect, the integrated circuit die, and the external interconnect having the upper tip and the lower tip exposed.

3. The system as claimed in claim 1 wherein encapsulating comprises:

encapsulating the interconnect; and

encapsulating the integrated circuit die and the external interconnect with the upper tip exposed.

4. The system as claimed in claim 1 wherein encapsulating comprises:

encapsulating the interconnect; and

encapsulating the integrated circuit die and the external interconnect with the upper tip and the lower tip exposed.

5. A stackable integrated circuit package system comprising:

forming a first integrated circuit die having an interconnect provided thereon;

forming a lead, having an upper tip and a lower tip, from a padless lead frame;

mounting the first integrated circuit die on the lead with the interconnect on the lower tip and below the upper tip; and

encapsulating around the interconnect with an exposed surface wherein encapsulating comprises:

encapsulating the interconnect;

encapsulating the integrated circuit die and the lead; and

exposing a non-active side of the integrated circuit die, the upper tip, and the lower tip.

6. The system as claimed in claim 5 further comprising:

attaching a second integrated circuit die to the stackable integrated circuit package system; and

encapsulating the second integrated circuit die.

7. The system as claimed in claim 5 further comprising attaching a first integrated circuit package to the stackable integrated circuit package system.

8. The system as claimed in claim 5 further comprising:

attaching another stackable integrated circuit package system to the stackable integrated circuit package system; and

attaching a second integrated circuit package on the another stackable integrated circuit package system.

9. A stackable integrated circuit package system comprising:

a first integrated circuit die having an interconnect provided thereon wherein the first integrated circuit die having the interconnect provided thereon comprises a distribution with interconnects in a configuration of an array distribution, a peripheral distribution, a partially depopulated distribution, a multiple pitch distribution, or a combination thereof;

an external interconnect, having an upper tip and a lower tip, from a lead frame;

the first integrated circuit die on the external interconnect with the interconnect on the lower tip and below the upper tip; and

a first mold compound to surround the interconnect with an exposed surface.

10. The system as claimed in claim 9 wherein the first mold compound to surround the interconnect comprises the first mold compound to surround the interconnect, the integrated circuit die, and the external interconnect having the upper tip and the lower tip exposed.

11. The system as claimed in claim 9 further comprising a second mold compound to cover the integrated circuit die and the external interconnect with the upper tip exposed.

12. The system as claimed in claim 9 further comprising a second mold compound to cover the integrated circuit die and the external interconnect with the upper tip and the lower tip exposed.

13. The system as claimed in claim 9 wherein:

the first integrated circuit die having the interconnect provided thereon is a flip chip;

the external interconnect, having the upper tip and the lower tip, from the lead frame is a lead;

the lead frame is a padless lead frame;

the first integrated circuit die on the external interconnect with the interconnect on the lower tip and below the upper tip has an active side; and

the first mold compound to surround the interconnect with the exposed surface is an epoxy mold compound.

14. The system as claimed in claim 13 further comprising:

a second mold compound to surround the integrated circuit die and the lead; and

a non-active side of the integrated circuit die, the upper tip, and the lower tip exposed.

15. The system as claimed in claim 13 further comprising:

a second integrated circuit die on the stackable integrated circuit package system; and

a third mold compound to cover the second integrated circuit die.

16. The system as claimed in claim 13 further comprising a first integrated circuit package on the stackable integrated circuit package system.

17. The system as claimed in claim 13 further comprising:

another stackable integrated circuit package system on the stackable integrated circuit package system; and

a second integrated circuit package on the another stackable integrated circuit package system.