Integrated circuit package system with multiple molding

1. A method for manufacturing an integrated circuit package system comprising:

forming a lead from a padless lead frame; and

encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding wherein encapsulating the lead for supporting the integrated circuit die with the first molding compound for encapsulation with the second molding compound comprises:

encapsulating the lead of the padless lead frame having a space with the first molding compound;

attaching the integrated circuit die on the first molding compound;

connecting an electrical interconnect between the integrated circuit die and the lead; and

encapsulating the integrated circuit die, the electrical interconnect, and a portion of the top of the lead with the second molding compound.

2. A method for manufacturing an integrated circuit package system comprising:

forming a lead from a padless lead frame; and

encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound, wherein encapsulating the lead for supporting the integrated circuit die with the first molding compound for encapsulation with the second molding compound comprises:

encapsulating a bottom of an inner portion of the lead of the padless lead frame with the first molding compound;

attaching the integrated circuit die on the first molding compound with an adhesive;

connecting an electrical interconnect between the integrated circuit die and the lead; and

encapsulating the integrated circuit die, the electrical interconnect, and the inner portion of the lead with the second molding compound from a top of the inner portion of the lead.

3. The method as claimed in claim 1 wherein forming the lead from the padless lead frame comprises forming a support from a corner of the padless lead frame to a diagonal corner of the padless lead frame.

4. The method as claimed in claim 1 wherein forming the lead from the padless lead frame comprises:

forming a support from a corner of the padless lead frame to a diagonal corner of the padless lead frame; and

forming a ground ring with a connection between the support at the corner to the support at an adjacent corner.

5. A method for manufacturing an integrated circuit package system comprising:

forming a lead from a padless lead frame;

encapsulating the lead with a first molding compound;

attaching an integrated circuit die on the first molding compound with an adhesive; and

encapsulating the integrated circuit die and the lead with a second molding compound.

6. The method as claimed in claim 5 wherein forming the lead from the padless lead frame comprises forming a support segment at a corner of the padless lead frame.

7. The method as claimed in claim 5 wherein forming the lead from the padless lead frame comprises:

forming a support segment at a corner of the padless lead frame; and

forming a ground ring with a connection between the support segment at the corner to the support segment at an adjacent corner.

8. The method as claimed in claim 5 further comprising attaching an electrical interconnect between the integrated circuit die and the lead.

9. The method as claimed in claim 5 wherein encapsulating the integrated circuit die, the electrical interconnect, and the lead with the second molding compound comprises forming a hermetic seal with the first molding compound and the second molding compound.

10. The method as claimed in claim 2 wherein forming the lead from the padless lead frame comprises forming a support from a corner of the padless lead frame to a diagonal corner of the padless lead frame.

11. The method as claimed in claim 2 wherein forming the lead from the padless lead frame comprises:

forming a support from a corner of the padless lead frame to a diagonal corner of the padless lead frame; and

forming a ground ring with a connection between the support at the corner to the support at an adjacent corner.