Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.
1. A carrier for carrying a stacked-type semiconductor device during packaging thereof comprising:
a plurality of accommodating sections for accommodating stacked semiconductor devices during packaging thereof;
guide portions within each of the plurality of accommodating sections for guiding peripheries of the stacked semiconductor devices; and
first grooves connecting with one or more of the plurality of accommodating sections through which a fluid may flow through the carrier to the one or more of the plurality of accommodating sections and to the peripheries of the stacked semiconductor devices accommodated within the one or more of the plurality of accommodating sections during the packaging of the stacked semiconductor devices.
2. The carrier as claimed in claim 1 , further comprising holes provided at corners of the plurality of accommodating sections, wherein a portion of the periphery of one of the stacked semiconductor devices is accommodated within the holes at the corners of one of the plurality of accommodating sections when the one of the stacked semiconductor devices is accommodated within the one of the plurality of accommodating sections.
3. The carrier as claimed in claim 2 , further comprising second grooves connecting adjacent ones of the holes provided in adjacent ones of the plurality of accommodating sections to each other.
4. The carrier as claimed in claim 2 , further comprising third grooves connecting the holes through a side of the carrier to outside the carrier.
5. The carrier as claimed in claim 4 , wherein the stacked semiconductor devices include a lowermost one thereof, and wherein the first and third grooves are deeper than a top of the lowermost one of the stacked semiconductor devices.
6. The carrier as claimed in claim 1 , further comprising holes that are provided in the first grooves and penetrate through the carrier to connect the first grooves to outside the carrier.
7. The carrier as claimed in claim 1 , wherein the first grooves are provided along sides of the one or more of the plurality of accommodating sections wherein the peripheries of the stacked semiconductor devices are accommodated.
8. The carrier as claimed in claim 1 , wherein the first grooves comprise a groove via through which a part of a terminal located at an end of the stacked semiconductor devices is exposed to outside the carrier.
9. The carrier as claimed in claim 1 , wherein sides of the first grooves are formed at an angle with respect to sides of the carrier such that the first grooves are wider at portions thereof towards the sides of the carrier than at portions thereof adjoining the accommodating section.
10. The carrier as claimed in claim 1 , wherein the stacked semiconductor devices include an uppermost one thereof, and wherein a top of the guide portions is higher than an upper surface of the uppermost one of the stacked semiconductor devices.
11. The carrier as claimed in claim 1 , wherein the guide portions are provided for at least two corners of the stacked semiconductor devices.
12. The carrier as claimed in claim 1 , wherein the plurality of accommodating sections, the guide portions and the first grooves are each portions of an integrally-formed single-piece member.
13. The carrier as claimed in claim 12 , wherein the integrally-formed single-piece member is a metal plate, and wherein the plurality of accommodating sections, the guide portions and the first grooves are formed by casting the metal plate.
14. The carrier as claimed in claim 12 , wherein the integrally-formed single-piece member is a metal plate, and wherein the plurality of accommodating sections, the guide portions and the first grooves are formed by forging the metal plate.
15. The carrier as claimed in claim 12 , wherein the integrally-formed single-piece member is a metal plate, and wherein the plurality of accommodating sections, the guide portions and the first grooves are formed by cutting the metal plate.