Integrated circuit comprising an organic semiconductor, and method for the production of an integrated circuit
View Patent ↗An embodiment of the invention provides an integrated circuit having an organic field effect transistor (OFET) with a dielectric layer. The dielectric layer is prepared from a polymer formulation comprising: about 100 parts of at least one crosslinkable base polymer, from about 10 to about 20 parts of at least one di- or tribenzyl alcohol compound as an electrophilic crosslinking component, from about 0.2 to about 10 parts of at least one photo acid generator, and at least one solvent. Another embodiment provides a semiconductor fabrication method. The method comprises applying the polymer formulation to a surface of a substrate, drying the polymer formulation, crosslinking the polymer formulation after drying, and baking the polymer formulation after crosslinking.
1. A method of producing a dielectric layer for an organic field effect transistor (OFET), the method comprising:
providing a substrate having a prestructured gate electrode;
applying a polymer formulation on the substrate, wherein the polymer formulation comprises:
a. about 100 parts of at least one crosslinkable base polymer,
b. from about 10 to about 20 parts of at least one di- or tribenzyl alcohol compound as an electrophilic crosslinking component,
c. from about 0.2 to about 10 parts of at least one photo acid generator; and
d. at least one solvent,
effecting a photoinduced crosslinking reaction after applying the polymer formulation;
performing a post exposure bake after effecting the photoinduced crosslinking reaction; and
applying a source-drain layer to the dielectric layer after performing post exposure bake.
2. The method as claimed in claim 1 , characterized wherein the photoinduced crosslinking reaction is initiated by exposure to UV radiation.
3. The method as claimed in claim 1 , wherein a temperature of the post exposure bake is less than about 140° C.
4. The method as claimed in claim 1 , wherein the polymer formulation is applied by spin coating, printing or spraying.
5. The method as claimed in claim 1 , wherein the photoinduced crosslinking reaction is effected under an inert gas atmosphere.
6. The method as claimed in claim 1 , further comprising drying the polymer formulation before effecting a photoinduced crosslinking reaction.
7. The method as claimed claim in 1 , further comprising applying an active layer to the source-drain layer, wherein the active layer comprises pentacene.
8. The method as claimed in claim 7 , further comprising arranging a passivating layer on the active layer.
9. A method of producing a dielectric layer for an organic field effect transistor (OFET), the method comprising:
providing a substrate having a prestructured gate electrode;
applying a polymer formulation on the subsrate, wherein the polymer formulation comprises:
a. about 100 parts of at least one crosslinkable base polymer,
b. from about 10 to about 20 parts of at least one compound as an electrophile crosslinking component,
c. from about 0.2 to about 10 parts of at least one photo acid generator, wherein the at least one photo acid generator is triphenylsulfonium hexaflate, and
d. at least one solvent;
effecting a photoinduced crossliniking reaction after applying the polymer formulation;
performing a post exposure bake after effecting the photoinduced crossliniking reaction; and
applying a source-drain layer to the dielectric layer after performing the post exposure bake,
wherein the compound comprises one of the following structures:
wherein R 1 comprises: —S—, —SO 2 —, —S x —, —(CH 2 ) x —, x=1-10, or one or more of the following structures:
wherein each occurrence of R 2 independently comprises an alkyl having 1 to 10 carbon atoms or an aryl.
10. A method of producing a dielectric layer for an organic field effect transistor (OFET), the method comprising:
providing a substrate having a prestructured gate electrode;
applying a polymer formulation on the substrate, wherein the polymer formulation comprises
a. about 100 parts by mass of at least one crosslinikable base polymer,
b. from about 10 to about 20 parts by mass of at least one compound as an electrophilic crossliniking component,
c. from about 0.2 to about 10 parts by mass of at least one photo acid generator, wherein the at least one photo acid generator is a sulfonium or an iodonium salt, and
d. at least one solvent;
effecting a photoinduced crossliniking reaction after applying the polymer formulation;
performing a post exposure bake after effecting the photoinduced crossliniking reaction; and
applying a source-drain layer to the dielectric layer after performing the post exposure bake
wherein the compound comprises
(1,4)di-hydroxymethyl benzene, (1,4)di-hydroxymethylnaphthalene,
4-hydroxymethylphenyl-4-hydroxymethylbenzene, (1,8)dihydroxymethylanthracene,
(1,3,4,6)-tetraflouro(2,5)dihydroxymethylbenzene, or the following structure:
wherein R 1 comprises: —S—, —SO 2 —, —S x —, —(CH 2 ) x —, x=1-10, or one or more of the following structures:
wherein each occurrence of R 2 independently comprises an alkyl having 1 to 10 carbon atoms or an aryl.