Flip chip interconnection pad layout
View Patent ↗A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from the signal pads; and has the signal pads on the corresponding package substrate arranged in a manner complementary to the die pad layout and the signal lines routed from the signal pads beneath the die edge away from the die footprint, and has the power and ground lines routed to vias beneath the die footprint. Also, a flip chip semiconductor package in which the flip chip interconnect pad layouts have the die signal pads situated in the marginal part of the die and the die power and ground pads arranged on the die surface inboard from the signal pads, and the corresponding package substrates have signal pads arranged in a manner complementary to the die pad layout and signal lines routed from the signal pads beneath the die edge away from the die footprint.
1. A semiconductor package, having a semiconductor chip mounted in a flip chip configuration on a substrate, the semiconductor chip having a die pad layout having signal pads disposed primarily in a perimeter region near an edge of the die, and having power/ground pads disposed primarily in an inboard region, wherein fewer than 10% of the power/ground pads are located within the perimeter region.
2. The package of claim 1 wherein the perimeter region consists essentially of a peripheral row generally parallel to a die edge.
3. The package of claim 1 wherein the perimeter region consists essentially of a peripheral array, generally parallel to a die edge.
4. The package of claim 3 wherein the signal pads are arranged primarily in at least two rows parallel to a die edge.
5. The package of claim 2 wherein the signal pads in adjacent rows are in a staggered arrangement.
6. The package of claim 2 wherein the signal pads in adjacent rows are in an orthogonal arrangement.
7. The package of claim 1 wherein the inboard region consists essentially of an array near the center of the die.
8. The package of claim 7 wherein the inboard region consists essentially of a rectangular array near the center of the die.
9. The package of claim 7 wherein a central area of the die has no pads.
10. The package of claim 1 wherein the power/ground pads are arranged primarily inboard from and near the signal pads.
11. The package of claim 1 wherein the power/ground pads are arranged primarily in a row parallel to a die edge inboard from and near the signal pads.
12. The package of claim 10 wherein the power/ground pads are arranged primarily in an array parallel to a die edge inboard from and near the signal pads.
13. The package of claim 1 wherein the power/ground pads are primarily arranged in at least two rows parallel to a die edge inboard from and near the signal pads.
14. The package of claim 1 wherein fewer than 5% of the power/ground pads are located within the perimeter region.
15. The package of claim 1 wherein fewer than 2% of the power/ground pads are located within the perimeter region.
16. The package of claim 1 wherein none of the power/ground pads is located within the perimeter region.
17. The package of claim 1 wherein fewer than 10% of the signal pads are located within the inboard region.
18. The package of claim 1 wherein fewer than 5% of the signal pads are located within the inboard region.
19. The package of claim 1 wherein fewer than 2% of the signal pads are located within the inboard region.
20. The package of claim 1 wherein none of the signal pads is located within the inboard region.
21. A semiconductor package comprising a semiconductor chip mounted on a substrate, the substrate comprising a die attach region including a die footprint, having signal pads located primarily in the margin of the die footprint, and having signal escape lines running in an upper metal layer outwardly and away from the die footprint, and having power pads and ground pads located primarily inwardly from the signal pads and ground and signal lines dropping through vias to lower metal layers, wherein fewer than 10% of the power/ground pads are located within the margin of the die footprint, and wherein fewer than 10% of the signal pads are located inwardly from the margin of the die footprint.
22. The package of claim 21 wherein the signal pads are arranged primarily in a row generally parallel to the edge of the die footprint.
23. The package of claim 21 wherein the signal pads are arranged primarily in an array.
24. The package of claim 21 wherein the signal pads are arranged in two or more rows generally parallel to the edge of the die footprint.
25. The package of claim 24 wherein the pads in adjacent rows are staggered.
26. The package of claim 24 wherein the pads in adjacent rows are arranged orthogonally.
27. The package of claim 21 wherein the power/ground pads are arranged primarily in an array near the center of the die attach region.
28. The package of claim 27 wherein the power/ground pads are arranged primarily in a rectangular array.
29. The package of claim 27 wherein a central area of the die attach region has no pads.
30. The package of claim 21 wherein the power/ground pads are arranged primarily inwardly from and near the signal pads.
31. The package of claim 21 wherein the power/ground pads are arranged primarily in a row parallel to a margin of the die footprint inward from and near the signal pads.
32. The package of claim 21 wherein the power/ground pads are arranged primarily in an array parallel to a margin of the die footprint inward from and near the signal pads.
33. The package of claim 32 wherein the power/ground pads are primarily arranged in at least two rows parallel to a margin of the die footprint inward from and near the signal pads.
34. The package of claim 33 wherein the ground/power pads in adjacent rows are in a staggered arrangement.
35. The package of claim 33 wherein the ground/power pads in adjacent rows are in an orthogonal arrangement.
36. A semiconductor package comprising a semiconductor chip mounted on a substrate, the substrate comprising a die attach region including a die footprint, having signal pads disposed primarily in a perimeter region of the die footprint, and having signal escape lines running in an upper metal layer outwardly and away from the die footprint, and having power/ground pads disposed primarily in an inboard region inward from the signal pads and ground and power lines dropping through vias to lower metal layers, wherein fewer than 10% of the power/ground pads are located within the perimeter region.
37. The package of claim 36 wherein fewer than 5% of the power/ground pads are located within the perimeter region.
38. The package of claim 36 wherein fewer than 2% of the power/ground pads are located within the perimeter region.
39. The package of claim 36 wherein none of the power/ground pads is located within the perimeter region.
40. The package of claim 36 wherein fewer than 10% of the signal pads are located within the inboard region.
41. The package of claim 36 wherein fewer than 5% of the signal pads are located within the inboard region.
42. The package of claim 36 wherein fewer than 2% of the signal pads are located within the inboard region.
43. The package of claim 36 wherein none of the signal pads is located within the inboard region.