Integrated circuit package system with multi-planar paddle

1. A method for manufacturing an integrated circuit package system comprising:

forming a multi-planar paddle having an outer uplift rim;

attaching an integrated circuit over the uplift rim of the multi-planar paddle, the integrated circuit providing an overhang of the integrated circuit over the multi-planar paddle with improved spacing between the integrated circuit and multiple rows of leads along a side of the integrated circuit; and

forming an encapsulation on the multi-planar paddle and on the integrated circuit, a bottom surface of the multi-planar paddle exposed from the encapsulation.

2. The method as claimed in claim 1 wherein forming the multi-planar paddle comprises forming an open pad configuration.

3. The method as claimed in claim 1 wherein forming the multi-planar paddle comprises forming a closed pad configuration.

4. The method as claimed in claim 1 further comprising attaching electrical connectors to the integrated circuit and the multiple rows of leads.

5. An integrated circuit package system comprising:

a multi-planar paddle having an outer uplift rim; and

an integrated circuit over the uplift rim of the multi-planar paddle, the integrated circuit includes an overhang of the integrated circuit over the multi-planar paddle with improved spacing between the integrated circuit and multiple rows of leads along a side of the integrated circuit; and

an encapsulation formed on the multi-planar paddle and on the integrated circuit, a bottom surface of the multi-planar paddle exposed from the encapsulation.

6. The system as claimed in claim 5 wherein the multi-planar paddle comprises an open pad configuration.

7. The system as claimed in claim 5 wherein the multi-planar paddle comprises a closed pad configuration.

8. The system as claimed in claim 5 further comprising electrical connectors attached to the integrated circuit and the multiple rows of leads.

9. The system as claimed in claim 5 wherein:

the multi-planar paddle having the uplift rim in a plane above a plane of a paddle base; and

the integrated circuit over the uplift rim and the paddle base of the multi-planar paddle.

10. The system as claimed in claim 9 wherein the integrated circuit comprises an epoxy on the uplift rim and the paddle base.

11. The system as claimed in claim 9 wherein the integrated circuit comprises a film on the uplift rim and an epoxy on the paddle base.

12. The system as claimed in claim 9 wherein the integrated circuit comprises an epoxy on the uplift rim.

13. The system as claimed in claim 9 wherein the integrated circuit comprises a film on the uplift rim.