Integrated circuit leadless package system
An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer contact pad around the die pad, forming an additional outer contact pad around the fishtail tie-bar, and forming an inner contact pad in a staggered position from the outer contact pad, mounting an integrated circuit on the die pad of the QFN leadframe, and attaching a bond wire from the integrated circuit to the additional outer contact pad.
1. An integrated circuit leadless package system comprising:
forming a leadframe comprises:
providing a die pad,
forming a tie-bar, having at least a portion of a fishtail shape, connected to the die pad,
forming an outer contact pad shorter than and next to the portion of the fishtail shape without another intervening contact pad between the outer contact pad and the tie-bar, and
forming an inner contact pad longer than and next to the outer contact pad;
mounting an integrated circuit on the die pad of the leadframe; and
attaching bond wires from the integrated circuit to the inner and outer contact pads.
2. The system as claimed in claim 1 wherein forming the tie-bar includes;
forming a vertical tie-bar or a horizontal tie-bar connected to the die pad; and
providing an additional outer contact pad next to the portion of the fishtail shape on the opposite side of the tie-bar from the outer contact pad.
3. The system as claimed in claim 1 wherein forming the tie-bar includes;
forming a fishtail shape; and
providing an additional outer contact pad next to the fishtail shape on the opposite side of the tie-bar from the outer contact pad.
4. The system as claimed in claim 1 wherein forming the tie-bar includes;
forming a clockwise tie-bar or a counter clockwise tie-bar connected to the die pad; and
providing an additional outer contact pad next to the portion of the fishtail shape on the opposite side of the tie-bar from the outer contact pad.
5. The system as claimed in claim 1 wherein forming the tie-bar includes;
forming a fishtail shape;
providing two outer contact pads within the fishtail shape; and
providing an additional outer contact pad next to the fishtail shape on the opposite side of the tie-bar from the outer contact pad.
6. An integrated circuit leadless package system comprising:
forming a QFN leadframe comprises:
providing a die pad in the center of the QFN leadframe,
forming bars, having at least portions of fishtail shapes, connected to each corner of the die pad,
forming outer contact pads shorter than and next to the portions of fishtail shapes without other intervening contact pads between the outer contact pad and the tie-bar, and
forming inner contact pads longer than and next to and in a staggered position from the outer contact pads;
mounting an integrated circuit on the die pad of the QFN leadframe;
attaching bond wires from the integrated circuit to the inner and outer contact pads; and
injecting a molding compound around the integrated circuit, the bond wire, and the QFN leadframe.
7. The system as claimed in claim 6 wherein forming the tie-bars includes;
forming vertical tie-bars or horizontal tie-bars conntected to the die pad, wherein the vertical tie-bars or the horizontal tie-bars are stamped, half etched, forged, or a combination thereof.
8. The system as claimed in claim 6 wherein forming the tie-bars includes;
forming fishtail shapes; and
providing additional outer contact pads next to the fishtail shapes on the opposite sides of the tie-bars from the outer contact pads.
9. The system as claimed in claim 6 wherein forming the tie-bars includes;
forming a clockwise tie-bars or a counter clockwise tie-bar connected to the die pad, wherein the clockwise tie-bars or the counter clockwise tie-bars are stamped, half etched, forged, or a combination thereof.
10. The system as claimed in claim 6 wherein forming the tie-bars includes;
forming fishtail shapes;
providing two outer contact pads within each of the fishtail shapes; and
providing additional outer contact pads next to the fishtail shapes on the opposite sides of the tie-bars from the outer contact pads.
11. An integrated circuit leadless package system comprising:
a leadframe comprises:
a die pad,
a tie-bar, having at least a portion of a fishtail shape, connected to the die pad,
an outer contact pad shorter than and next to the portion of the fishtail shape without another intervening contact pad between the outer contact pad and the tie-bar, and
an inner contact pad longer than and next to the outer contact pad;
an integrated circuit mounted on the die pad of the leadframe; and
bond wires attached from the integrated circuit to the inner and outer contact pads.
12. The system as claimed in claim 11 wherein the tie-bar includes;
a vertical tie-bar or a horizontal tie-bar connected to the die pad; and
an additional outer contact pad provided next to the portion of the fishtail shape on the opposite side of the tie-bar from the outer contact pad.
13. The system as claimed in claim 11 wherein the tie-bar includes;
a fishtail shape; and
an additional outer contact pad provided next to the fishtail shape on the opposite side of the tie-bar from the outer contact pad.
14. The system as claimed in claim 11 wherein the tie-bar includes;
a clockwise tie-bar or a counter clockwise tie-bar connected to the die pad; and
an additional outer contact pad provided next to the portion of the fishtail shape on the opposite side of the tie-bar from the outer contact pad.
15. The system as claimed in claim 11 wherein the tie-bar includes;
a fishtail shape;
two outer contact pads provided within the fishtail shape; and
an additional outer contact pad provided next to the fishtail shape on the opposite side of the tie-bar from the outer contact pad.
16. The system as claimed in claim 11 , wherein:
the leadframe is a QFN leadframe wherein:
the die pad is centered in the QFN leadframe,
the tie-bar is one of a plurality of tie-bars, having at least portions of fishtail shapes, connected to each corner of the die pad, and
the inner contact pad is one of a plurality of inner contact pads formed around the tie-bars; further comprising:
a molding compound injected around the integrated circuit, the bond wires, and the QFN leadframe.
17. The system as claimed in claim 16 wherein the tie-bar includes;
clockwise tie-bars or counter clockwise tie-bars connected to the die pad, wherein the clockwise tie-bars or the counter clockwise tie-bar are stamped, half etched, forged, or a combination thereof.
18. The system as claimed in claim 16 wherein the tie-bar includes;
fishtail shapes:
two outer contact pads within each of the fishtail shapes; and
additional outer contact pads next to the fishtail shapes on the opposite sides of the tie-bars from the outer contact pads.
19. The system as claimed in claim 16 wherein the tie-bar includes;
vertical tie-bars or horizontal tie-bars connected to the die pad, wherein the vertical tie-bars or the horizontal tie-bars are stamped, half etched, forged, or a combination thereof.
20. The system as claimed in claim 16 wherein the tie-bar includes;
fishtail shapes; and
additional outer contact pads next to the fishtail shapes on the opposite sides of the tie-bars from the outer contact pads.