Integrated circuit package system with downset lead
An integrated circuit package system includes an integrated circuit package having a downset terminal lead, a planar recessed lead surface of the downset terminal lead, and an attached integrated circuit over the planar recessed lead surface.
1. An integrated circuit package system comprising:
providing an integrated circuit package having a downset terminal lead;
forming a planar recessed lead surface, a terminal external surface, and a terminal top wall of the downset terminal lead, the planar recessed lead surface on a side opposite the terminal external surface, the terminal external surface substantially planar to a plane of a package bottom surface, and the terminal top wall adjacent the planar recessed lead surface, for controlling connector collapse;
attaching an integrated circuit over the planar recessed lead surface; and
forming a die paddle having a half-etched region for bump collapse control.
2. The system as claimed in claim 1 wherein forming the planar recessed lead surface comprises forming a half-etched region of the downset terminal lead.
3. The system as claimed in claim 1 further comprising forming a locking feature of the downset terminal lead for encapsulant integrity.
4. The system as claimed in claim 1 further comprising forming a die paddle having a mold locking feature for encapsulant integrity.
5. An integrated circuit package system comprising:
an integrated circuit package having a downset terminal lead;
a planar recessed lead surface, a terminal external surface, and a terminal top wall of the downset terminal lead, the planar recessed lead surface on a side opposite the terminal external surface, the terminal external surface substantially planar to a plane of a package bottom surface, and the terminal top wall adjacent the planar recessed lead surface, for controlling connector collapse;
an integrated circuit over the planar recessed lead surface; and a die paddle having a half-etched region for bump collapse control.
6. The system as claimed in claim 5 wherein the planar recessed lead surface comprises a half-etched region of the downset terminal lead.
7. The system as claimed in claim 5 further comprising a locking feature of the downset terminal lead for encapsulant integrity.
8. The system as claimed in claim 5 further comprising a die paddle having a mold locking feature for encapsulant integrity.
9. The system as claimed in claim 5 wherein:
the integrated circuit over the planar recessed lead surface of the downset terminal lead and the die paddle; and
the integrated circuit package having a die paddle and a downset terminal lead including a planar recessed lead surface, a terminal external surface, and a terminal top wall, the planar recessed lead surface on a side opposite the terminal external surface, the terminal external surface substantially coplanar to a plane of a package bottom surface, and the terminal top wall adjacent the planar recessed lead surface, for controlling connector collapse;
further comprising:
an electrical connector between the integrated circuit and the planar recessed lead surface.
10. The system as claimed in claim 9 wherein the integrated circuit package comprises a half-etched surface of the die paddle.
11. The system as claimed in claim 9 wherein the integrated circuit package comprises a partially half-etched surface of the die paddle.
12. The system as claimed in claim 9 wherein the integrated circuit package comprises the planar recessed lead surface at an inner edge of the downset terminal lead.
13. The system as claimed in claim 9 wherein the integrated circuit package comprises the planar recessed lead surface with a predetermined setback from an inner edge of the downset terminal leads.