Integrated circuit encapsulation system with vent

1. An integrated circuit encapsulation system with vent comprising:

providing a sheet material;

forming a leadframe array on the sheet material;

forming a leadframe air vent adjacent to a lead stringer in the last row on the leadframe array;

attaching an integrated circuit to the leadframe array;

mounting the leadframe array in a mold; and

encapsulating the integrated circuit and the leadframe array.

2. The system as claimed in claim 1 further comprising forming a half-etched flipchip leadframe within the leadframe array.

3. The system as claimed in claim 1 wherein forming the leadframe air vent includes half-etching a path for air to escape the mold.

4. The system as claimed in claim 1 further comprising forming a reservoir, a slot hole, or a combination thereof on the leadframe array.

5. The system as claimed in claim 1 wherein encapsulating the leadframe array comprises injecting an encapsulant into the mold and forcing air out the leadframe air vent.

6. An integrated circuit encapsulation system with vent comprising:

providing a sheet material includes providing a copper sheet;

forming a leadframe array on the sheet material;

forming a leadframe air vent adjacent to a lead stringer in the last row on the leadframe array, for venting air during the encapsulation process, includes stamping or etching;

attaching an integrated circuit to the leadframe array;

mounting the leadframe array in a mold comprises attaching an adhesive tape between the leadframe array and the mold; and

encapsulating the integrated circuit and the leadframe array.

7. The system as claimed in claim 6 further comprising forming a half-etched flipchip leadframe within the leadframe array.

8. The system as claimed in claim 6 wherein forming the leadframe air vent includes half-etching a path for air to escape the mold.

9. The system as claimed in claim 6 further comprising forming a reservoir, a slot hole, or a combination thereof.

10. The system as claimed in claim 6 wherein encapsulating the leadframe array comprises injecting an encapsulant into the mold and forcing air out the leadframe air vent.

11. An integrated circuit encapsulation system with vent comprising:

a sheet material;

a leadframe array formed on the sheet material;

a leadframe air vent formed adjacent to a lead stringer in the last row on the leadframe array;

an integrated circuit attached to the leadframe array;

the leadframe array mounted in a mold; and

the integrated circuit and the leadframe array encapsulated.

12. The system as claimed in claim 11 further comprising a half-etched flipchip leadframe formed within the leadframe array.

13. The system as claimed in claim 11 wherein the leadframe air vent includes half-etching a path for air to escape the mold.

14. The system as claimed in claim 11 further comprising a reservoir, a slot hole, or a combination thereof formed on the leadframe array.

15. The system as claimed in claim 11 wherein the leadframe array encapsulated comprises an encapsulant injected into the mold and air forced out the leadframe air vent.

16. The system as claimed in claim 11 wherein:

the sheet material includes copper, and

the leadframe air vent includes stamping or etching; and further comprises:

an adhesive tape attached between the leadframe array and the mold.

17. The system as claimed in claim 16 further comprising a half-etched flipchip leadframe formed within the leadframe array.

18. The system as claimed in claim 16 wherein the leadframe air vent includes half-etching a path for air to escape the mold.

19. The system as claimed in claim 16 further comprising a reservoir, a slot hole, or a combination thereof formed on the leadframe array.

20. The system as claimed in claim 16 wherein the leadframe array encapsulated comprises an encapsulant injected into the mold and air forced out the leadframe air vent.