Integrated circuit heat spreader stacking method
View Patent ↗An integrated circuit heat spreader stacking system is provided including mounting an integrated circuit on a substrate, forming a heat spreader, forming a stacking stand-off for the heat spreader, and mounting a heat spreader over the integrated circuit.
1. An integrated circuit heat spreader stacking method comprising:
mounting an integrated circuit on a substrate;
forming a plurality of heat spreaders each having a stacking stand-off and a heat sink dome;
forming a stack of heat spreaders by stacking the heat spreaders with the stacking stand-off of one of the heat spreaders on another one of the heat spreaders;
singly selecting one of the heat spreaders from the stack of heat spreaders; and
mounting the selected heat spreader over the integrated circuit with the heat sink dome being over the integrated circuit,
wherein forming the stacking stand-off of one of the heat spreaders comprises forming a protruding portion from the one of the heat spreaders, so as to prevent corresponding two neighboring heat spreaders in the stack from sticking together by providing a vertical displacement therebetween.
2. The method as claimed in claim 1 further comprising forming a position support feature of the heat spreader.
3. The method as claimed in claim 1 , wherein forming the protruding portion comprises forming a corner tab from the heat spreader.
4. The method as claimed in claim 1 , wherein forming the protruding portion comprises forming a punched tab from the heat spreader.
5. The method as claimed in claim 1 , wherein forming the protruding portion comprises forming a surface dimple from the heat spreader.
6. An integrated circuit heat spreader stacking method comprising:
mounting an integrated circuit on a substrate;
forming a plurality of heat spreaders each having a heat sink dome;
forming an extension piece for each of the heat spreaders;
forming a stacking stand-off from the extension piece by bending the extension piece;
forming a stack of heat spreaders by stacking the heat spreaders with the stacking stand-off of one of the heat spreaders on another one of the heat spreaders;
singly selecting one of the heat spreaders from the stack of heat spreaders; and
mounting the selected heat spreader over the integrated circuit, including placing the heat sink dome over the integrated circuit,
wherein the stacking stand-off of one of the heat spreaders prevents corresponding two neighboring heat spreaders in the stack from sticking together by providing a vertical displacement therebetween.
7. The method as claimed in claim 6 , wherein forming the stack standing-off comprises forming a corner tab from the heat spreader and bending the corner tab.
8. The method as claimed in claim 6 , wherein forming the stack standing-off comprises forming a punched vertical tab from the heat spreader.
9. The method as claimed in claim 6 , wherein forming the stack standing-off comprises forming a surface dimple from the heat spreader.