Integrated circuit package system with window opening

1. A method of manufacturing an integrated circuit package system comprising:

providing a bottom lid;

mounting a base integrated circuit over the bottom lid; and

attaching a top lid with an integrated circuit window opening over the bottom lid with the base integrated circuit at least partially in the top lid under the integrated circuit window.

2. The method as claimed in claim 1 wherein attaching a top lid with an integrated circuit window opening includes attaching the top lid on the bottom lid.

3. The method as claimed in claim 1 further comprising mounting a stacked integrated circuit over the base integrated circuit.

4. The method as claimed in claim 1 further comprising attaching a substrate over the bottom lid.

5. The method as claimed in claim 1 further comprising attaching a cover over the base integrated circuit.

6. A method of manufacturing an integrated circuit package system comprising:

forming a bottom lid with external connectors:

mounting a base integrated circuit having a step over the bottom lid; and

attaching a top lid with an integrated circuit window opening over the bottom lid with the base integrated circuit at least partially in the top lid under the integrated circuit window.

7. The method as claimed in claim 6 wherein attaching the top lid with the integrated circuit window opening includes forming the integrated circuit window opening having planar dimensions equal to or greater than planar dimensions of a stacked integrated circuit.

8. The method as claimed in claim 6 wherein attaching the top lid with an integrated circuit window opening includes forming an opening having approximately 1.14 mm between a mounting surface and an outer surface of the top lid.

9. The method as claimed in claim 6 wherein forming the bottom lid with external connectors includes forming connectors of a secure digital memory module.

10. The method as claimed in claim 6 further comprising forming a step over the base integrated circuit.

11. An integrated circuit package system comprising:

a bottom lid;

a base integrated circuit over the bottom lid; and

a top lid with an integrated circuit window opening over the bottom lid with the base integrated circuit at least partially in the top lid under the integrated circuit window.

12. The system as claimed in claim 11 wherein a top lid with an integrated circuit window opening includes the top lid on the bottom lid.

13. The system as claimed in claim 11 further comprising a stacked integrated circuit over the base integrated circuit.

14. The system as claimed in claim 11 further comprising a substrate over the bottom lid.

15. The system as claimed in claim 11 further comprising a cover over the base integrated circuit.

16. The system as claimed in claim 11 wherein:

the bottom lid is the bottom lid with external connectors;

the base integrated circuit is the base integrated circuit having a step over the bottom lid; and

the top lid is the top lid with an integrated circuit window opening over the bottom lid providing an integrated circuit cavity.

17. The system as claimed in claim 16 wherein the top lid with the integrated circuit window opening includes the integrated circuit window opening having planar dimensions equal to or greater than planar dimensions of a stacked integrated circuit.

18. The system as claimed in claim 16 wherein the top lid with an integrated circuit window opening includes an opening having approximately 1.14 mm between a mounting surface and an outer surface of the top lid.

19. The system as claimed in claim 16 wherein the bottom lid with external connectors includes connectors of a secure digital memory module.

20. The system as claimed in claim 16 further comprising a step over the base integrated circuit.