IP Library Granted Patent US 7,911,226
Granted Patent B2
US 7,911,226 · App. 11/467,279 · Granted Mar 22, 2011

Power-up and power-down circuit for system-on-a-chip integrated circuit

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Quick Facts
Patent No.
US 7,911,226
App. No.
11/467,279
Granted
Mar 22, 2011
Kind
B2
Abstract

A power-up and power-down circuit for an integrated circuit includes a voltage regulator set for a first voltage. A first I/O pad is coupled internally to an input to the voltage regulator and to first internal circuits. The second voltage is externally coupled to the first I/O pad. A second I/O pad is coupled internally to an output of the voltage regulator configured to drive the base of an external transistor. A third I/O pad of the integrated circuit is coupled internally to a reference-voltage input of the voltage regulator. A fourth I/O pad is coupled to a feedback input of the voltage regulator. A fifth I/O pad of the integrated circuit is coupled internally to logic circuitry that controls power-up and power down of the integrated circuit from internal signals including internal signals from a real-time clock circuit disposed on the integrated circuit.

Claims (22)

1. A power-up and power-down circuit for use on an integrated circuit having circuits using a first power-supply voltage and a second power-supply voltage comprising:

a first I/O pad;

a second I/O pad;

a third I/O pad;

a fourth I/O pad;

a fifth I/O pad coupled to circuits in the integrated circuit that use the second voltage;

a bandgap reference;

a voltage regulator set for the first voltage, having an input coupled to the first I/O pad and to circuits in the integrated circuit that use the second voltage, an output coupled to the second I/O pad, a reference input of the internal voltage regulator coupled to the bandgap reference, a first-voltage feedback input coupled to the third I/O pad, and an enable input;

logic circuitry coupled to the fourth I/O pad and configured to drive the enable input of the voltage regulator in response to logic signals from the fifth I/O pad; and

a transistor having a first terminal coupled to the first I/O pad, a gate coupled to the second I/O pad, and a second terminal coupled to the third I/O pad.

2. The power-up and power-down circuit of claim 1 further including:

a real-time clock powered by the second voltage; and

wherein the logic circuitry is coupled to the real-time clock and the fourth I/O pad, and is configured to drive the enable input of the voltage regulator in response to logic signals from at least one of the real-time clock and the fourth I/O pad.

3. The power-up and power-down circuit of claim 1 further including:

programmable logic; and

wherein the logic circuitry is coupled to the programmable logic and the fourth I/O pad, and is configured to drive the enable input of the voltage regulator in response to logic signals from at least one of the programmable logic and the fourth I/O pad.

4. The power-up and power-down circuit of claim 3 wherein:

the programmable logic is powered by the first voltage.

5. The power-up and power-down circuit of claim 1 wherein:

the transistor is an external NPN transistor connected as an emitter follower with the first terminal the collector, the gate the base, and the second terminal the emitter.

6. The power-up and power-down circuit of claim 5 which further comprises:

a filter capacitor coupled between the second terminal of the transistor and ground.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0572 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT Recorded Nov 11, 2011
From: MICROSEMI CORPORATION; MICROSEMI CORP. - ANALOG MIXED SIGNAL GROUP; MICROSEMI CORP. - MASSACHUSETTS; ACTEL CORPORATION
To: MORGAN STANLEY & CO. LLC
Reel/Frame 027213/0611 →