Integrated circuit package system with encapsulation lock
An integrated circuit package system is provided including forming an external interconnect having a lead tip and a lead body, forming a recess in the lead body from a lead body top surface, connecting an integrated circuit die and the external interconnect, and molding the external interconnect with the recess filled.
1. A method of manufacturing an integrated circuit package system comprising:
forming an external interconnect having a lead tip and a lead body includes half etching the external interconnect to form the lead tip and the lead body;
forming a recess in the lead body including a first recess segment, having an orientation substantially parallel to the lengthwise dimension of the lead body, and a second recess segment intersecting and perpendicular to the first recess segment along a lead body top surface of the lead body as shown in the plan view, the first recess segment at a bottom portion of the second recess segment;
connecting an integrated circuit die and the external interconnect; and
molding the external interconnect with the recess filled.
2. The method as claimed in claim 1 wherein the connecting includes attaching a solder bump between the integrated circuit die and the lead tip.
3. The method as claimed in claim 1 wherein the connecting includes attaching a bond wire between the integrated circuit die and the lead tip.
4. The method as claimed in claim 1 wherein forming the recess includes forming the first recess segment and the second recess segment having a length and a width including a perimeter of the first recess segment and the second recess segment on the lead body top surface.
5. The method as claimed in claim 1 wherein the molding includes covering the integrated circuit die.
6. A method of manufacturing an integrated circuit package system comprising:
forming an external interconnect, a tie bar, and a paddle;
forming a lead tip and a lead body includes half etching the external interconnect to form the lead tip and the lead body;
forming a recess in the lead body including a first recess segment, having an orientation substantially parallel to the lengthwise dimension of the lead body, and a second recess segment intersecting and perpendicular to the first recess segment along a lead body top surface of the lead body as shown in the plan view, the first recess segment at a bottom portion of the second recess segment;
connecting an integrated circuit die, over the paddle, and the external interconnect; and
molding the external interconnect with the recess filled.
7. The method as claimed in claim 6 wherein forming the tie bar and the paddle includes connecting the tie bar and the paddle.
8. The method as claimed in claim 6 wherein the molding the external interconnect includes:
exposing the lead body at a lead body bottom surface; and
covering the lead tip.
9. The method as claimed in claim 6 wherein the molding includes covering the tie bar and the paddle.