Integrated circuit package system with lead structures including a dummy tie bar
View Patent ↗An integrated circuit package system includes forming lead structures including a dummy tie bar having an intersection with an outer edge of the integrated circuit package system, and connecting an integrated circuit die to the lead structures.
1. A method for manufacturing an integrated circuit package system comprising:
providing lead structures in a row;
forming a dummy tie bar between the lead structures in the row and directly attached to an outer lead, the dummy tie bar having an intersection with an outer edge of the integrated circuit package system; and
connecting an integrated circuit die to the lead structures.
2. The method as claimed in claim 1 wherein forming the lead structures includes forming the dummy tie bar near an outer terminal pad.
3. The method as claimed in claim 1 wherein forming the lead structures includes forming an inner terminal pad.
4. The method as claimed in claim 1 wherein forming the lead structures includes forming an inner terminal tie bar.
5. The method as claimed in claim 1 further comprising singulating the integrated circuit die.
6. A method for manufacturing an integrated circuit package system comprising:
providing lead structures;
forming a dummy tie bar between the lead structures and directly attached to an outer lead, the dummy tie bar having an intersection with an outer edge of the integrated circuit package system and an outer terminal pad;
connecting an integrated circuit die to the outer terminal pad; and
singulating an integrated circuit package including the integrated circuit die, the dummy tie bar attached to an outer lead.
7. The method as claimed in claim 6 wherein forming the lead structures includes forming the dummy tie bar attached to the outer terminal pad.
8. The method as claimed in claim 6 wherein forming the lead structures includes forming an inner terminal pad adjacent to the outer terminal pad.
9. The method as claimed in claim 6 wherein forming the lead structures includes forming an inner terminal tie bar adjacent to the outer terminal pad.
10. The method as claimed in claim 6 wherein singulating the integrated circuit package includes forming the dummy tie bar near an edge of the integrated circuit package.
11. An integrated circuit package system comprising:
lead structures:
a dummy tie bar between the lead structures directly attached to an outer lead, the dummy tie bar having an intersection with an outer edge of the integrated circuit package system; and
an integrated circuit die connected to the lead structures.
12. The system as claimed in claim 11 wherein the lead structures includes the dummy tie bar near an outer terminal pad.
13. The system as claimed in claim 11 wherein the lead structures includes an inner terminal pad.
14. The system as claimed in claim 11 wherein the lead structures includes an inner terminal tie bar.
15. The system as claimed in claim 11 further comprising the integrated circuit die singulated.
16. The system as claimed in claim 11 wherein:
the lead structures are the lead structures including the dummy tie bar having an intersection with an outer edge of the integrated circuit package system and an outer terminal pad;
the integrated circuit is the integrated circuit connected to the outer terminal pad; and further comprising:
an integrated circuit package including the integrated circuit die.
17. The system as claimed in claim 16 wherein the lead structures includes the dummy tie bar attached to the outer terminal pad.
18. The system as claimed in claim 16 wherein the lead structures includes an inner terminal pad adjacent to the outer terminal pad.
19. The system as claimed in claim 16 wherein the lead structures includes an inner terminal tie bar adjacent to the outer terminal pad.
20. The system as claimed in claim 16 wherein the integrated circuit package includes the dummy tie bar near an edge of the integrated circuit package.