Integrated circuit packaging system with interposer

1. An integrated circuit packaging method comprising:

providing an enhanced ball grid array substrate having a signal trace in a step;

mounting an integrated circuit adjacent to the step;

forming an interposer having a coupling slot;

securing an upper die on the interposer;

mounting the interposer over the integrated circuit and the step

coupling the integrated circuit to the upper die through the coupling slot; and

electrically connecting the integrated circuit to the signal trace through the interposer.

2. The method as claimed in claim 1 further comprising:

securing a second upper die on the interposer;

coupling an integrated passive device to the interposer; and

electrically connecting the upper die, the second upper die, the integrated passive

device, or a combination thereof to the integrated circuit.

3. The method as claimed in claim 1 wherein coupling the integrated circuit to the upper die includes bonding an electrical interconnect.

4. An integrated circuit packaging method comprising:

providing an enhanced ball grid array substrate having a first signal trace in a first step and a second signal trace in a second step;

mounting an integrated circuit adjacent to the first step;

forming an interposer having a coupling slot;

forming bond pads around the coupling slot;

securing an upper die on the interposer including electrically connecting the upper die to a bond pad;

mounting the interposer over the integrated circuit and the first step including positioning the coupling slot over the integrated circuit;

coupling the integrated circuit to the upper die through the coupling slot including bonding an electrical interconnect through the coupling slot; and

electrically connecting the integrated circuit to the first signal trace or the second signal trace through the interposer.

5. The method as claimed in claim 4 further comprising:

securing a second upper die on the interposer including electrically connecting the second upper die to the interposer;

coupling an integrated passive device to the interposer includes electrically connecting the integrated passive device to the upper die, the second upper die, the bond pad, or a combination thereof; and

electrically connecting the upper die, the second upper die, the integrated passive device, or a combination thereof to the integrated circuit includes bonding the electrical interconnect between the bond pad and the integrated circuit.

6. The method as claimed in claim 4 wherein coupling the integrated circuit to the upper die includes connecting the electrical interconnect to the bond pad on the interposer.

7. An integrated circuit packaging system comprising:

an enhanced ball grid array substrate having a signal trace in a step;

an integrated circuit mounted adjacent to the step;

an interposer having a coupling slot;

an upper die on the interposer;

the interposer over the integrated and the step;

the integrated circuit coupled to the upper die through the coupling slot; and

the integrated circuit electrically connected to the signal trace through the interposer.

8. The system as claimed in claim 7 further comprising:

a second upper die on the interposer;

an integrated passive device coupled to the interposer; and

the upper die, the second upper die, the integrated passive device, or a combination thereof electrically connected to the integrated circuit.

9. The system as claimed in claim 7 wherein the integrated circuit coupled to the upper die includes an electrical interconnect bonded to the integrated circuit.

10. The system as claimed in claim 7 further comprising:

a second signal trace in a second step of the enhanced ball grid array substrate;

bond pads formed around the coupling slot;

the upper die electrically connected to a bond pad;

the coupling slot positioned over the integrated circuit;

an electrical interconnect bonded through the coupling slot; and

the integrated circuit electrically connected to the signal trace, the second signal trace, or a combination thereof through the interposer.

11. The system as claimed in claim 10 further comprising:

a second upper die on the interposer includes the second upper die electrically connected to the interposer;

an integrated passive device coupled to the interposer includes the integrated passive device electrically connected to the upper die, the second upper die, the bond pad, or a combination thereof; and

the upper die, the second upper die, the integrated passive device, or a combination thereof electrically connected to the integrated circuit includes the electrical interconnect bonded between the bond pad and the integrated circuit.

12. The system as claimed in claim 10 wherein the integrated circuit coupled to the upper die includes the electrical interconnect connected to the bond pad on the interposer.