IP Library Granted Patent US 7,665,058
Granted Patent B2
US 7,665,058 · App. 11/724,663 · Granted Feb 16, 2010

Customizable development and demonstration platform for structured ASICs

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Quick Facts
Patent No.
US 7,665,058
App. No.
11/724,663
Granted
Feb 16, 2010
Kind
B2
Abstract

The present invention is directed to a customizable development and demonstration platform for structured ASICs. In an exemplary aspect of the present invention, the present platform may include a structured ASIC which is built on a slice and which may be flexible enough for a number of possible application developments. This flexibility may be achieved by incorporating a programmable processor in the structured ASIC and by defining interfaces and the use of an external FPGA in the present platform. The structured ASIC may include a complete ARM processor subsystem and a plurality of high speed SERDES ports. The processor subsystem may include a bus interface to the external FPGA, allowing custom gate development and test in the FPGA, prior to incorporating it into the customer product. Through the SERDES ports, the test block may be used to show the electrical characteristics of the SERDES IP. In addition, some SERDES ports may be driven from a link layer realized in the FPGA. This may allow the same chip and board to implement SATA (serial advanced technology attachment), GigE, XAUI, XGXS, Fiber Channel, and the like by changing the programming of the FPGA on the board.

Claims (15)

1. A customizable development and demonstration platform for structured ASICs, comprising:

a structured ASIC built on a slice, including a programmable processor and a plurality of high speed SERDES ports; and

a FPGA communicatively coupled to said structured ASIC;

wherein one of said plurality of high speed SERDES ports is driven by a test block in said structured ASIC to run signal integrity tests and when said platform is for demonstration use, distribution software in the form of open source RTOS and router applications are ported to said platform.

2. The platform of claim 1 , wherein at least one of said a plurality of high speed SERDES port is pinned out to be driven by said FPGA.

3. The platform of claim 2 , wherein said at least one of said a plurality of high speed SERDES port is driven from a link layer realized in said FPGA.

4. The platform of claim 3 , wherein said platform implements at least one of SATA, GigE, XAUI, XGXS, and Fibre Channel.

5. The platform of claim 1 , wherein the number of said a plurality of high speed SERDES ports is eight.

6. The platform of claim 1 , wherein said a plurality of high speed SERDES ports are GigaBlaze ports.

7. The platform of claim 1 , wherein a second port of said a plurality of high speed SERDES ports is connected to a direct memory device in said structured ASIC for allowing flexible pattern transmission.

8. The platform of claim 1 , wherein said FPGA is used to implement a PCI Express interface to develop a PCI Express endpoint vehicle.

9. The platform of claim 1 , wherein said programmable processor is an ARM processor.

10. The platform of claim 1 , wherein said structured ASIC further comprises at least one of low speed serial interface and 10/100 Ethernet port, through which external I/Os are supported.

11. The platform of claim 1 , wherein said test block is used to show electrical characteristics of intellectual property of said a plurality of high speed SERDES ports.

12. The platform of claim 1 , wherein said structured ASIC is a RapidChip™ and said slice is a RapidSlice™.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0223 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044887/0109 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
MERGER Recorded Dec 30, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 023721/0051 →
MERGER Recorded Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →