Integrated circuit package system with different mold locking features

1. A method of manufacture of an integrated circuit package system comprising:

forming a first inner lead having a top side and a first inner bottom side;

forming an outer lead offset from the first inner lead;

forming a first side lock extending laterally from the first inner lead, the first side lock having a lock bottom side parallel to a lock top side coplanar to the top side with a contoured side between the first side lock and the first inner bottom side;

connecting an integrated circuit die with the first inner lead and the first outer lead; and

encapsulating the integrated circuit die and the first side lock.

2. The method as claimed in claim 1 further comprising forming a front inner lock, of the first inner lead above the first inner bottom side, extending toward the first integrated circuit die.

3. The method as claimed in claim 1 wherein forming the outer lead includes forming a second lead having a second side lock above a first bottom side of the outer lead.

4. The method as claimed in claim 1 wherein forming the outer lead includes forming a third lead having a second side lock and a front lock above a first bottom side of the outer lead.

5. The method as claimed in claim 1 wherein forming the first side lock above a first inner bottom side includes forming a front inner lock extending toward the integrated circuit die.

6. A method of manufacture of an integrated circuit package system comprising:

forming a first inner lead having a top side and a first inner bottom side;

forming an outer lead offset from the first inner lead;

forming a first side lock extending laterally from the first inner lead, the first side lock having a lock bottom side parallel to a lock top side coplanar to the top side with a contoured side between the first side lock and the first inner bottom side;

forming a front outer lock of the outer lead including protruding as an overhang from a top side of the outer lead;

connecting an integrated circuit die with the first inner lead and the first outer lead; and

encapsulating the integrated circuit die and the first side lock.

7. The method as claimed in claim 6 wherein:

forming the first inner lead includes:

forming a contact portion having a contact width integral with a non-contact portion and having the contact width greater than the non-contact width; and

forming the first side lock includes:

forming the first side lock from the contact portion.

8. The method as claimed in claim 6 wherein:

forming the first inner lead includes:

forming a contact portion having a contact width integral with a non-contact portion and having the contact width greater than the non-contact width; and

further comprising:

forming a front lock from the contact portion above the first inner bottom side.

9. The method as claimed in claim 6 wherein connecting the integrated circuit die includes connecting the integrated circuit die having a rectangular geometric configuration.

10. The method as claimed in claim 6 wherein:

forming the first inner lead includes:

forming a contact portion having a contact width integral with a non-contact portion and having the contact width greater than the non-contact width; and

further comprising:

forming an elevated side of the non-contact portion above the first inner bottom side.

11. An integrated circuit package system comprising:

an outer lead;

a first inner lead having a top side and a first inner bottom side adjacent to the first outer lead with a first side lock laterally extended from the top side of the first inner lead, the first side lock having a lock bottom side parallel to a lock top side coplanar to the top side with a contoured side between the first side lock and the first inner bottom side;

an integrated circuit die connected to the first inner lead and the first outer lead; and

an encapsulation over the integrated circuit die and the first side lock.

12. The system as claimed in claim 11 wherein the first inner lead includes a front inner lock above the first inner bottom side extending toward the integrated circuit die.

13. The system as claimed in claim 11 wherein the outer lead includes a second outer lead with a second side lock above a first bottom side of the first outer lead.

14. The system as claimed in claim 11 wherein the outer lead includes a third outer lead with second side lock and a front lock above a first bottom side of the first outer lead.

15. The system as claimed in claim 11 wherein the first side lock above the first inner bottom side includes a front inner lock extended toward the integrated circuit die.

16. The system as claimed in claim 11 wherein:

the first outer lead has a first front lock; and

the encapsulation is over the first front lock.

17. The system as claimed in claim 16 wherein the first inner lead includes a contact portion having a contact width integral with a non-contact portion and having the contact width greater than the non-contact width; and the contact portion includes the first side lock.

18. The system as claimed in claim 16 wherein the first inner lead includes a contact portion having a contact width integral with a non-contact portion and having the contact width greater than the non-contact width; and the contact portion includes a front lock above the first inner bottom side.

19. The system as claimed in claim 16 wherein the integrated circuit die has a rectangular geometric configuration.

20. The system as claimed in claim 16 wherein the first inner lead includes a contact portion having a contact width integral with a non-contact portion and having the contact width greater than the non-contact width; and the non-contact portion includes an elevated side above the first inner bottom side.