Integrated circuit package system employing resilient member mold system technology
An integrated circuit package system that includes: providing a support structure including a device and an electrical contact adjacent thereto; providing a mold system having a cavity, a recess channel, a recess integrally connected to the recess channel, and a resilient member that cooperatively engages the recess channel and the recess; engaging the mold system and the support structure with the cavity over the device and the resilient member between the device and the electrical contact; and injecting encapsulation material into the cavity.
1. An integrated circuit package system comprising:
a support structure;
a device mounted on the support structure; and
an encapsulant having an encapsulant rim, the encapsulant rim is a non-horizontal portion of the encapsulant in direct contact with the support structure and having a concave surface characteristic of being formed from an elastic resilient member pressed against the support structure.
2. The system as claimed in claim 1 wherein:
the encapsulant protects the device without obscuring an electrical contact formed adjacent thereto.
3. The system as claimed in claim 1 further comprising an inter-device structure affixed to the support structure for blocking disruptive fields.
4. The system as claimed in claim 1 wherein:
the support structure includes a printed wiring board, a flexible circuit substrate, or a leadframe.
5. The system as claimed in claim 1 wherein:
the device includes semiconductor chips and integrated circuit packages.
6. The system as claimed in claim 1 wherein:
the device includes a first package and a second package.
7. The system as claimed in claim 1 wherein:
the device includes a second package that is not coplanar with the support structure.
8. The system as claimed in claim 1 wherein:
the integrated circuit package system includes a fan-in package-on-package structure.
9. The system as claimed in claim 1 wherein:
the encapsulant protects the device without obscuring an electrical interconnect array formed on a substrate of a second package.
10. The system as claimed in claim 9 wherein:
the electrical interconnect array is a ball grid array.
11. The system as claimed in claim 9 further comprising:
an electrical interconnect formed over the electrical interconnect array.
12. The system as claimed in claim 1 further comprising an electrical contact adjacent to the device for electrically connecting additional components and packages formed over the device.