IP Library Granted Patent US 7,579,868
Granted Patent B2
US 7,579,868 · App. 11/843,575 · Granted Aug 25, 2009

Architecture for routing resources in a field programmable gate array

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Quick Facts
Patent No.
US 7,579,868
App. No.
11/843,575
Filed
Aug 22, 2007
Granted
Aug 25, 2009
Kind
B2
Art Unit
2819
USPC
326/41
Abstract

A turning structure for routing channels in a field programmable gate array, comprising a first plurality of routing channels having a first direction and a second plurality of routing channels having a second direction. The first plurality of routing channels intersects the second plurality of routing channels to form a plurality of matrices of intersecting interconnect conductors in the routing channels. A first number of reprogrammable elements is disposed at intersections in at least one of the plurality of matrices, a second number of reprogrammable elements disposed at intersections in at least one of the plurality of matrices. The second number of reprogrammable elements is greater than the first number of reprogrammable elements, and a third number of reprogrammable elements disposed at intersections in at least one of the plurality of matrices. The third number of reprogrammable elements is greater than the second number of reprogrammable elements.

Claims (58)

1. An integrated circuit device containing a field programmable gate away having an architecture for routing channels comprising:

a first plurality of routing channels having a first direction;

a second plurality of routing channels having a second direction perpendicular to said first direction, said first plurality of routing channels intersecting said second plurality of routing channels to form a plurality of matrices of intersecting interconnect conductors in said routing channels;

a first number of reprogrammable elements disposed at intersections in a first one of said plurality of matrices, said first number of reprogrammable elements disposed on said intersecting interconnect conductors in a first pattern;

a second number of reprogrammable elements disposed at intersections in a second one of said plurality of matrices, said second number of reprogrammable elements greater than said first number of reprogrammable elements, and said second number of reprogrammable elements disposed on said intersecting interconnect conductors in a second pattern distinct from said first pattern;

a third number of reprogrammable elements disposed at intersections in a third one of said plurality of matrices, said third number of reprogrammable elements greater than said second number of reprogrammable elements, and said third number of reprogrammable elements disposed on said intersecting interconnect conductors in a third pattern distinct from said first pattern and said second pattern; and

a plurality of logic blocks coupled to one another through said first plurality of routing channels and said second plurality of routing channels, wherein each one of said plurality of logic blocks comprises a plurality of clusters, each one of said plurality of logic clusters comprising a plurality of lookup tables each having a plurality of inputs and an output and a D flip-flop having an input and an output.

2. The integrated circuit device of claim 1 , wherein:

said plurality of lookup tables comprising:

at least one three-input lookup table.

3. The integrated circuit device of claim 1 , wherein:

said plurality of lookup tables comprising:

at least two three-input lookup table; and

at least one two-input lookup table.

4. The integrated circuit device of claim 1 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal pattern.

5. The integrated circuit device of claim 1 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal minus one pattern.

6. The integrated circuit device of claim 1 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal minus two pattern.

7. The integrated circuit device of claim 1 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal minus three pattern.

8. The integrated circuit device of claim 1 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal plus one pattern.

9. The integrated circuit device of claim 1 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal plus two pattern.

10. The integrated circuit device of claim 1 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal plus three pattern.

11. The integrated circuit device of claim 1 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a fully populated pattern.

12. A method of providing a field programmable gate array having an architecture for routing channels comprising:

providing a first plurality of routing channels having a first direction;

providing a second plurality of routing channels having a second direction perpendicular to said first direction, said first plurality of routing channels intersecting said second plurality of routing channels to form a plurality of matrices of intersecting interconnect conductors in said routing channels;

disposing a first number of reprogrammable elements at intersections in a first one of said plurality of matrices, said first number of reprogrammable elements disposed on said intersecting interconnect conductors in a first pattern;

disposing a second number of reprogrammable elements at intersections in a second one of said plurality of matrices, said second number of reprogrammable elements greater than said first number of reprogrammable elements, and said second number of reprogrammable elements disposed on said intersecting interconnect conductors in a second pattern distinct from said first pattern;

disposing a third number of reprogrammable elements at intersections in a third one of said plurality of matrices, said third number of reprogrammable elements greater than said second number of reprogrammable elements, and said third number of reprogrammable elements disposed on said intersecting interconnect conductors in a third pattern distinct from said first pattern and said second pattern;

providing a plurality of logic blocks, wherein each one of said plurality of logic blocks comprises a plurality of clusters, each one of said plurality of logic clusters comprising a plurality of lookup tables each having a plurality of inputs and an output and a D flip-flop having an input and an output; and

coupling the plurality of logic blocks to one another through said first plurality of routing channels and said second plurality of routing channels.

13. The integrated circuit device of claim 12 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal pattern.

14. The integrated circuit device of claim 12 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal minus one pattern.

15. The integrated circuit device of claim 12 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal minus two pattern.

16. The integrated circuit device of claim 12 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal minus three pattern.

17. The integrated circuit device of claim 12 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal plus one pattern.

18. The integrated circuit device of claim 12 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal plus two pattern.

19. The integrated circuit device of claim 12 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a diagonal plus three pattern.

20. The integrated circuit device of claim 12 , wherein:

one of said first number, said second number, and said third number of reprogrammable elements are disposed on said intersecting interconnect conductors in a fully populated pattern.

21. The integrated circuit device of claim 12 , wherein:

said plurality of lookup tables comprises:

at least two three-input lookup table; and

at least one two-input lookup table.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037380/0504 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →