Integrated circuit package system with package encapsulation having recess

1. A method of manufacturing an integrated circuit package system comprising:

forming an external interconnect;

connecting an integrated circuit die and the external interconnect;

forming a package encapsulation covering the integrated circuit die with an inner portion of the external interconnect in a recess of the package encapsulation including not covering the interior portion of the external interconnect by the package encapsulation; and

connecting an integrated circuit device and the external interconnect, on the interior portion, in the recess including not covering or contacting the integrated circuit device by the package encapsulation, the external interconnect attached between the integrated circuit device and the integrated circuit die.

2. The method as claimed in claim 1 wherein:

forming the external interconnect includes:

forming a die-attach paddle; and

further comprising:

mounting the integrated circuit die to the die-attach paddle.

3. The method as claimed in claim 1 further comprising:

forming a mounting structure over the external interconnect with the mounting structure having a material not included in the external interconnect; and

mounting the integrated circuit die over the mounting structure.

4. The method as claimed in claim 1 further comprising:

forming an adhesive layer over the external interconnect; and

mounting the integrated circuit die over the adhesive layer.

5. The method as claimed in claim 1 further comprising:

forming an inner tip exposed in the recess;

connecting the integrated circuit die and the inner tip; and

wherein connecting the integrated circuit device and the external interconnect in the recess includes:

connecting the integrated circuit device and the inner tip in the recess.

6. A method of manufacturing an integrated circuit package system comprising:

forming an external interconnect;

connecting an integrated circuit die to the external interconnect;

forming a package encapsulation for covering the integrated circuit die with the external interconnect partially exposed by a recess of the package encapsulation including not covering an interior portion on the external interconnect, at an opposing side with the integrated circuit die, by the package encapsulation; and

connecting an integrated circuit device and the external interconnect, on the interior portion, in the recess including not covering or contacting the integrated circuit device by the package encapsulation, the external interconnect attached between the integrated circuit device and the integrated circuit die.

7. The method as claimed in claim 6 wherein connecting the integrated circuit device and the external interconnect in the recess includes mounting the integrated circuit device over the integrated circuit die.

8. The method as claimed in claim 6 further comprising forming an inner encapsulation for covering the integrated circuit device in the recess.

9. The method as claimed in claim 6 wherein forming the package encapsulation includes forming a channel in the package encapsulation adjacent to the external interconnect in the recess.

10. The method as claimed in claim 6 wherein connecting the integrated circuit device includes mounting a packaged integrated circuit.

11. An integrated circuit package system comprising:

an external interconnect;

an integrated circuit die connected with the external interconnect;

a package encapsulation for covering the integrated circuit die with an interior portion of the external interconnect in a recess of the package encapsulation in which the interior portion of the external interconnect is not covered by the package encapsulation; and

an integrated circuit device mounted on the interior portion and connected with the external interconnect in the recess includes the integrated circuit device is not covered by and does not contact the package encapsulation, the external interconnect attached between the integrated circuit device and the integrated circuit die.

12. The system as claimed in claim 11 further comprising a die-attach paddle with the integrated circuit die mounted to the die-attach paddle.

13. The system as claimed in claim 11 further comprising a mounting structure over the external interconnect with the mounting structure having a material not included in the external interconnect and the integrated circuit die over the mounting structure.

14. The system as claimed in claim 11 further comprising an adhesive layer over the external interconnect with the integrated circuit die over the adhesive layer.

15. The system as claimed in claim 11 further comprising:

an inner tip exposed in the recess with the integrated circuit die connected with the inner tip; and

wherein the integrated circuit device connected with the external interconnect in the recess includes:

the integrated circuit device connected with the inner tip in the recess.

16. The system as claimed in claim 11 wherein the package encapsulation includes the recess with the mounting surface, on the external interconnect at an opposing side from the integrated circuit die, not covered by the package encapsulation.

17. The system as claimed in claim 16 wherein the integrated circuit device is over the integrated circuit die.

18. The system as claimed in claim 16 further comprising an inner encapsulation for covering the integrated circuit device in the recess.

19. The system as claimed in claim 16 wherein the package encapsulation includes a channel adjacent to the external interconnect in the recess.

20. The system as claimed in claim 16 wherein the integrated circuit device is a packaged integrated circuit.