Integrated circuit package system with external interconnects at high density

1. An integrated circuit package system comprising:

a die-attach paddle;

an integrated circuit die over the die-attach paddle;

at least one radiating structure having at least three radiating interconnects; and

an encapsulation having an isolation hole horizontally offset from the die-attach paddle and over the integrated circuit die and the radiating structure; and

wherein:

each of the three radiating interconnects includes:

a radiating tiebar,

an external interconnect connected to an end of the radiating tiebar and electrically to the integrated circuit die, and

a portion of an opposite end of each of the radiating tiebars, facing away from the external interconnect, having an orientation characteristic of extending from the isolation hole, and exposed by the isolation hole isolating the external interconnects from each other.

2. The system as claimed in claim 1 wherein the external interconnects are in a radiating configuration from the isolation hole.

3. The system as claimed in claim 1 wherein the encapsulation is between the external interconnects and over the isolation hole.

4. The system as claimed in claim 1 wherein the external interconnects are parallel to borders of the encapsulation.

5. The system as claimed in claim 1 wherein the encapsulation is over a portion of the die-attach paddle.

6. The system as claimed in claim 5 wherein the isolation hole is adjacent to a boundary of the encapsulation.

7. The system as claimed in claim 5 wherein the isolation hole is adjacent to the die-attach paddle.

8. The system as claimed in claim 5 wherein the external interconnects connected with the integrated circuit die includes multiple rows of the external interconnects in a staggered configuration connected with the integrated circuit die.

9. The system as claimed in claim 5 wherein the die-attach paddle is exposed from the encapsulation.