Integrated circuit package system with leadframe array

1. An integrated circuit package system comprising:

providing an integrated circuit die;

attaching the integrated circuit die over a lead grid having lead blocks and an interposer with the lead blocks extending below the interposer; and

connecting a die interconnect to the integrated circuit die and the lead blocks; and wherein a gap fill material fills a gap between the lead blocks and under a bottom surface of the interposer.

2. The system as claimed in claim 1 wherein connecting the die interconnect is between the integrated circuit die and the interposer.

3. The system as claimed in claim 1 further comprising attaching a lead interconnect to one of the lead blocks and another of the lead blocks.

4. The system as claimed in claim 1 further comprising attaching a lead interconnect to one of the lead blocks and an interposer.

5. An integrated circuit package system comprising:

providing an integrated circuit die;

attaching the integrated circuit die over a predetermined region of a lead grid having lead blocks and an interposer with the lead blocks extending below the interposer in a shape of rows and columns;

connecting a die interconnect to the integrated circuit die and the lead blocks adjacent the predetermined region;

applying an encapsulant over the die interconnect, the integrated circuit die, and the lead blocks; and

wherein a gap fill material fills a gap between the lead blocks and under a bottom surface of the interposer.

6. The system as claimed in claim 5 wherein providing the lead grid includes forming the lead blocks in a shape of substantially orthogonal rows and columns.

7. The system as claimed in claim 5 wherein providing the lead grid includes forming an interposer between the lead blocks.

8. The system as claimed in claim 5 further comprising attaching a lead interconnect to one of the lead blocks and another of the lead blocks in the predetermined region of the lead grid.

9. The system as claimed in claim 5 further comprising attaching a lead interconnect to one of the lead blocks and an interposer in the predetermined region of the lead grid.

10. An integrated circuit package system comprising:

an integrated circuit die;

a lead grid having lead blocks and an interposer with the integrated circuit die thereover and with the lead blocks extending below the interposer; and

a die interconnect connected to the integrated circuit die and the lead blocks; and

a gap fill material filling a gap between the lead blocks and under a bottom surface of the interposer.

11. The system as claimed in claim 10 wherein the die interconnect is between the integrated circuit die and the interposer.

12. The system as claimed in claim 10 further comprising a lead interconnect attached to one of the lead blocks and another of the lead blocks.

13. The system as claimed in claim 10 further comprising a lead interconnect attached to one of the lead blocks and an interposer.

14. The system as claimed in claim 10 wherein:

the integrated circuit die is over a predetermined region of the lead grid having the lead blocks in a shape of rows and columns;

the die interconnect is connected to the integrated circuit die and the lead blocks adjacent the predetermined region; and

further comprising:

an encapsulant over the die interconnect, the integrated circuit die, and the lead blocks.

15. The system as claimed in claim 14 wherein the lead grid includes the lead blocks in a shape of substantially orthogonal rows and columns.

16. The system as claimed in claim 14 wherein the lead grid includes an interposer between the lead blocks.

17. The system as claimed in claim 14 further comprising a lead interconnect attached to one of the lead blocks and another of the lead blocks in the predetermined region of the lead grid.

18. The system as claimed in claim 14 further comprising a lead interconnect attached to one of the lead blocks and an interposer in the predetermined region of the lead grid.