Integrated circuit package system with multiple die
View Patent ↗An integrated circuit package system includes providing die; forming leads adjacent the die; forming a die paddle adjacent the leads with the die thereover; and forming a cavity for isolating one of the die and a die attach segment of the die paddle.
1. A method for manufacture of an integrated circuit package system comprising:
providing a die paddle having a cavity to a predetermined depth in the die paddle for electrically isolating a first die attach segment and a second die attach segment of the die paddle;
forming a plurality of leads adjacent the die paddle;
attaching a first die to the first die attach segment and connected to at least some of the plurality of leads; and
attaching a second die to the second die attach segment and connected to at least some of the plurality of leads.
2. The method as claimed in claim 1 wherein forming the cavity includes forming an encapsulant cavity over a die paddle cavity.
3. The method as claimed in claim 1 wherein forming the die paddle includes forming a die paddle support for isolating the die attach segment of the die paddle.
4. The method as claimed in claim 1 wherein forming the die paddle includes forming an isolation cut line.
5. The method as claimed in claim 1 wherein forming the die paddle includes forming an isolation region.
6. A method for manufacture of an integrated circuit package system comprising:
providing a first and a second integrated circuit die;
forming leads adjacent outer edges of the integrated circuit die;
forming a base die paddle adjacent the leads wherein the first integrated circuit die is adjacent the second integrated circuit die over the base die paddle; and
forming a die paddle cavity to a predetermined depth in the base die paddle for electrically isolating a first and a second die attach segment in the die attach paddle for isolating each of the integrated circuit die attached to each of the die attach segments of the base die paddle.
7. The method as claimed in claim 6 wherein forming the die paddle cavity includes etching the base die paddle for isolation.
8. The method as claimed in claim 6 wherein forming the die paddle cavity includes sawing the base die paddle for isolation.
9. The method as claimed in claim 6 wherein forming the die paddle cavity includes laser cutting the base die paddle for isolation.
10. The method as claimed in claim 6 wherein forming the die paddle cavity includes drilling the base die paddle with a ganged drill apparatus.
11. An integrated circuit package system comprising:
a die paddle having a cavity to a predetermined depth in the die paddle for electrically isolating a first die attach segment and a second die attach segment of the die paddle;
a plurality of leads adjacent the die paddle;
a first die attached to the first die attach segment and connected to at least some of the plurality of leads; and
a second die attached to the second die attach segment and connected to at least some of the plurality of leads.
12. The system as claimed in claim 11 wherein the cavity includes an encapsulant cavity over a die paddle cavity.
13. The system as claimed in claim 11 wherein the die paddle includes a die paddle support for isolating the die attach segment of the die paddle.
14. The system as claimed in claim 11 wherein the die paddle includes an isolation cut line.
15. The system as claimed in claim 11 wherein the die paddle includes an isolation region.
16. The system as claimed in claim 11 wherein:
the die are integrated circuit die;
the leads are adjacent outer edges of the integrated circuit die; and
the die paddle is a base die paddle adjacent the leads with the first integrated circuit die adjacent the second integrated circuit die over the base die paddle.
17. The system as claimed in claim 16 further comprising an encapsulant having opposite outer encapsulant edges with the cavity extending thereto.
18. The system as claimed in claim 16 wherein the die paddle having the cavity includes the die paddle having a first cavity intersecting a second cavity.
19. The system as claimed in claim 16 further comprising an encapsulant partially exposing the first die attach segment and the second die attach segment.
20. The system as claimed in claim 16 further comprising an encapsulant partially covering the first die attach segment and the second die attach segment.