Integrated circuit package system including die stacking
View Patent ↗An integrated circuit package system includes providing a leadframe, forming an aperture within the leadframe, mounting an integrated circuit package over or under the aperture, and mounting a die over the integrated circuit package with the die located within the aperture.
1. An integrated circuit package system comprising:
providing a dual row leadframe;
forming an aperture within the leadframe;
mounting an integrated circuit package to the leadframe over or under the aperture; and
mounting a die over the integrated circuit package, the die located within the aperture.
2. The system as claimed in claim 1 wherein:
mounting the integrated circuit package includes mounting wire bond packages, flip-chip packages, or stacked die packages.
3. The system as claimed in claim 1 wherein:
mounting the integrated circuit package includes mounting quad-flat non-leaded packages, dual-side memory packages, or internal stacking module packages.
4. The system as claimed in claim 1 wherein:
mounting the die includes stacking wire bond die, flip chip die, stacked die or combinations thereof.
5. An integrated circuit package system comprising:
a dual row leadframe having an aperture provided therein;
an integrated circuit package mounted to the leadframe over or under the aperture; and
a die mounted over the integrated circuit package, the die located within the aperture.
6. The system as claimed in claim 5 wherein:
the integrated circuit package includes wire bond packages, flip-chip packages, or stacked die packages.
7. The system as claimed in claim 5 wherein:
the integrated circuit package includes quad-flat non-leaded packages, dual-side memory packages, or internal stacking module packages.
8. The system as claimed in claim 5 wherein:
the die includes wire bond die, flip chip die, stacked die or combinations thereof.