Integrated circuit package system with package integration

1. An integrated circuit package system comprising:

providing a package substrate having a package opening;

providing a base package having a base package cavity;

electrically connecting the base package to the package substrate with the base package cavity over the package opening; and

attaching a device partially in the package opening and partially in the base package cavity and connected to the portion of the base package substantially exposed.

2. The system as claimed in claim 1 wherein providing a base package having a base package cavity includes attaching the base package over the package substrate wherein a base package cavity of the base package is over the package opening of the package substrate.

3. The system as claimed in claim 1 wherein providing a base package having a base package cavity includes providing the base package having the base package cavity over a second package substrate of the base package.

4. The system as claimed in claim 1 further comprising attaching a top package over the base package.

5. The system as claimed in claim 1 further comprising forming an upper cavity in a package encapsulant over a first package substrate of the base package.

6. An integrated circuit package system comprising:

forming a package substrate having a package substrate opening;

mounting a base package having a base package cavity and a second package substrate wherein a portion of the second package substrate is substantially exposed over the package substrate;

electrically connecting the base package to the package substrate wherein the base package cavity is substantially aligned to the package substrate opening; and

mounting a device partially within the package opening and connected to the substantially exposed portion of the second package substrate.

7. The system as claimed in claim 6 wherein attaching the device includes attaching a stack package.

8. The system as claimed in claim 6 wherein attaching the device includes attaching a passive component.

9. The system as claimed in claim 6 further comprising attaching a bottom package over the cavity.

10. The system as claimed in claim 6 further comprising attaching an interposer over the cavity.

11. The system as claimed in claim 6 further comprising attaching a top package over the base package with embedded solder-on-pad.

12. An integrated circuit package system comprising:

a package substrate having a package opening;

a base package having a base package cavity;

the base package electrically connected to the package substrate with the base package cavity over the package opening; and

a device partially in the package opening and partially in the base package cavity and connected to the portion of the base package substantially exposed.

13. The system as claimed in claim 12 wherein the base package cavity includes the base package over the package substrate wherein a base package cavity of the base package is over a package opening of the package substrate.

14. The system as claimed in claim 12 wherein the base package cavity is over a second package substrate of the base package.

15. The system as claimed in claim 12 further comprising a top package over the base package.

16. The system as claimed in claim 12 further comprising an upper cavity in a package encapsulant over a first package substrate of the base package.

17. The system as claimed in claim 12 wherein:

the package substrate is the package substrate having a package substrate opening;

the base package is the base package having a base package cavity and a second package substrate wherein a portion of the second package substrate is substantially exposed over the package substrate;

the cavity is the cavity through the package substrate to the base package wherein the base package cavity is substantially aligned to the package substrate opening; and

the device is the device partially within the cavity and connected to the substantially exposed portion of the second package substrate.

18. The system as claimed in claim 17 wherein the device is a stack package.

19. The system as claimed in claim 17 wherein the device is a passive component.

20. The system as claimed in claim 17 further comprising a bottom package over the cavity.

21. The system as claimed in claim 17 further comprising an interposer over the cavity.

22. The system as claimed in claim 17 further comprising a top package over the base package with embedded solder-on-pad.