Integrated circuit package system with underfill

1. A method of manufacturing an integrated circuit package system comprising:

providing a package carrier;

forming a first channel in the package carrier;

forming a second channel in contact with the first channel;

mounting a first integrated circuit device over the package carrier and adjacent to the first channel;

mounting a second integrated circuit device over the package carrier and adjacent to the first channel and the second channel; and

forming a contiguous underfill fillet with the first channel and under both the first integrated circuit device and the second integrated circuit device.

2. The method as claimed in claim 1 wherein mounting the first integrated circuit device over the package carrier and adjacent to the first channel includes mounting a first side of the first integrated circuit device adjacent to the first channel without covering the first channel.

3. The method as claimed in claim 1 wherein mounting the first integrated circuit device over the package carrier and adjacent to the first channel includes mounting the first integrated circuit device over the package carrier and adjacent to the first channel which does not extend beyond a first side of the first integrated circuit device.

4. The method as claimed in claim 1 wherein forming the first channel in the package carrier includes forming the first channel with a solder resist of the package carrier.

5. A method for manufacturing an integrated circuit package system comprising:

providing a package carrier;

forming a first channel in contact with a second channel in the package carrier with the second channel substantially perpendicular to the first channel;

mounting a first integrated circuit device over the package carrier and adjacent to the first channel;

mounting a second integrated circuit device over the package carrier and adjacent to the first channel and the second channel; and

forming a contiguous underfill fillet over the first channel and the second channel and under both the first integrated circuit device and the second integrated circuit device.

6. The method as claimed in claim 5 wherein mounting the first integrated circuit device over the package carrier and adjacent to the first channel includes mounting a first side of the first integrated circuit device adjacent to the first channel without covering the first channel and the second channel.

7. The method as claimed in claim 5 wherein mounting the first integrated circuit device over the package carrier and adjacent to the first channel includes mounting the first integrated circuit device over the package carrier and adjacent to the first channel which does not extend beyond a first side of the first integrated circuit device.

8. The method as claimed in claim 5 wherein forming the first channel in contact with the second channel includes forming the first channel and the second channel with patterned solder resist.

9. The method as claimed in claim 5 further comprising mounting a third integrated circuit device over the package carrier and adjacent to at least one of the first channel and the second channel.

10. An integrated circuit package system comprising:

a package carrier having a first channel and a second channel in contact with the first channel;

a first integrated circuit device mounted over the package carrier and adjacent to the first channel;

a second integrated circuit device mounted over the package carrier and adjacent to the first channel and the second channel; and

a contiguous underfill fillet over the first channel and under both the first integrated circuit device and the second integrated circuit device.

11. The system as claimed in claim 10 wherein the first integrated circuit device is over the package carrier and adjacent to the first channel without covering the first channel.

12. The system as claimed in claim 10 wherein the first integrated circuit device is over the package carrier and adjacent to the first channel which does not extend beyond a first side of the first integrated circuit device.

13. The system as claimed in claim 10 wherein the first channel includes a solder resist.

14. The system as claimed in claim 10 wherein:

the package carrier includes the second channel in contact with the first channel and the second integrated circuit device is adjacent to the second channel; and

the contiguous underfill fillet is over the second channel.

15. The system as claimed in claim 14 wherein the second channel includes a solder resist.

16. The system as claimed in claim 14 further comprising a third integrated circuit device over the package carrier and adjacent to at least one of the first channel and the second channel.

17. The system as claimed in claim 14 further comprising external connective elements attached to a bottom side of the package carrier.

18. The system as claimed in claim 14 further comprising:

a third integrated circuit device over the package carrier and adjacent to at least one of the first channel and the second channel; and

wherein the contiguous underfill fillet is under the third integrated circuit device.