Package system for shielding semiconductor dies from electromagnetic interference
A method of manufacturing a package system includes: providing a semiconductor die with a contact pad and a ground pad, mounting the semiconductor die on a package substrate using and adhesive layer, forming a vertical conductive structure on top of the ground pad in the semiconductor die, encapsulating at least portions of the semiconductor die, the vertical conductive structure, and the package substrate using an encapsulant, covering at least portions of the encapsulant and the vertical conductive structure with a shielding layer to place the vertical conductive structure in electrical contact with the shielding layer, and connecting the shielding layer to the package substrate.
1. A method of manufacturing a package system comprising:
providing a semiconductor die with a contact pad and a ground pad;
mounting the semiconductor die on a package substrate using an adhesive layer;
forming a vertical conductive structure as a sole path to ground on top of the ground pad in the semiconductor die;
encapsulating at least portions of the semiconductor die, the vertical conductive structure, and package substrate using an encapsulant;
covering at least portions of the encapsulant and the vertical conductive structure with a shielding layer to place the vertical conductive structure in electrical contact with the shielding layer; and
connecting the shielding to the package substrate.
2. The method as claimed in claim 1 wherein mounting the semiconductor die uses a leadframe as the package substrate.
3. The method as claimed in claim 1 wherein connecting the shielding layer to the package substrate is performed using a conductive bump or ball placed between the shielding layer and the package substrate.
4. The method as claimed in claim 1 wherein connecting the shielding layer to the package substrate is performed by placing a portion of the shielding layer on the package substrate.
5. The method as claimed in claim 1 further comprising forming a connection between the ground pad and the package substrate using a bond wire and wherein the forming of the vertical conductive structure is performed on top of the end of the bond wire at the ground pad.
6. A method for manufacturing a package system comprising:
providing a semiconductor die with a contact pad and ground pad;
mounting the semiconductor die on a package substrate using and adhesive layer;
connecting the contact pad in the semiconductor die to the package substrate using a bond wire;
forming a vertical conductive structure as a sole path to ground on top of the ground pad in the semiconductor die;
encapsulating at least portions of the semiconductor die, the vertical conductive structure, the bond wire, and the package substrate using an encapsulant;
covering at least portions of the encapsulant and the vertical conductive structure with a shielding layer to place the vertical conductive structure in asymmetrical electrical contact with the shielding layer; and
connecting the shielding layer to the package substrate.
7. The method as claimed in claim 6 wherein mounting the semiconductor die is performed on a leadframe.
8. The method as claimed in claim 6 wherein forming the vertical conductive structure is performed by stacking gold stud bumps.
9. The method as claimed in claim 6 wherein forming the vertical conductive structure is performed by extruding a gold stud bump.
10. The method as claimed in claim 6 further comprising removing a top portion of the encapsulant to expose the top surface of the vertical conductive structure prior to covering at least portions of the encapsulant and the vertical conductive structure with a shielding layer.
11. A package system comprising:
a semiconductor die with a contact pad and a ground pad;
a package substrate for supporting the semiconductor die;
a vertical conductive structure as a sole path to ground defined on top of the ground pad;
an encapsulant for encapsulation of at least portions of the semiconductor die and the vertical conductive structure; and
a shielding layer connected to the vertical conductive structure for providing shielding from electromagnetic interference.
12. The system as claimed in claim 11 wherein the package substrate is a leadframe.
13. The system as claimed in claim 11 further comprising a bond wire for connecting the contact pad to portions of the package substrate.
14. The system as claimed in claim 11 further comprising bond wire for connecting the contact pad to portions of the package substrate and wherein the vertical conductive structure is placed on top of the end of the bond wire at the ground pad.
15. The system as claimed in claim 11 further comprising a conductive bump or ball for connecting the package system on another package substrate in a stacked configuration.
16. The system as claimed in claim 11 wherein the shielding layer is connected to the package substrate.
17. The system as claimed in claim 16 wherein the shielding layer is connected to the package substrate using a solder bump or ball.
18. The system as claimed in claim 16 wherein the vertical conductive structure is composed of vertically stacked gold stud bumps.
19. The system as claimed in claim 16 wherein the vertical conductive structure is composed of an extruded gold stud bump.
20. The system as claimed in claim 16 wherein the top surface of the vertical conductive structure is in electrical contact with the shielding layer.