Mountable integrated circuit package system with substrate
View Patent ↗A mountable integrated circuit package system includes: providing a substrate having an opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger; mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; and connecting the external leadfinger and the substrate.
1. A mountable integrated circuit package system comprising:
providing a substrate having a through opening provided therein;
providing an encapsulated integrated circuit package having an external leadfinger;
mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; and
connecting a shoulder of the external leadfinger and the substrate.
2. The system as claimed in claim 1 wherein mounting the encapsulated integrated circuit package includes connecting an outer tip of the external leadfinger and the substrate.
3. The system as claimed in claim 1 further comprising forming an outer encapsulation over the encapsulated integrated circuit package.
4. The system as claimed in claim 1 further comprising forming an outer encapsulation over the encapsulated integrated circuit package, partially exposing the external leadfinger from the outer encapsulation.
5. A mountable integrated circuit package system comprising:
providing a substrate having a through opening provided therein;
providing an encapsulated integrated circuit package having an external leadfinger;
mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate;
connecting the external leadfinger and the substrate;
forming an external interconnect under the substrate; and
connecting a first stacking integrated circuit device mounted over the encapsulated integrated circuit package, and the external leadfinger.
6. The system as claimed in claim 5 further comprising connecting a first stacking integrated circuit device, mounted over the encapsulated integrated circuit package, and the substrate.
7. The system as claimed in claim 5 further comprising connecting a first stacking integrated circuit device, mounted under the encapsulated integrated circuit package, and the substrate.
8. The system as claimed in claim 5 further comprising:
forming an outer encapsulation over the encapsulated integrated circuit package, partially exposing the outer tip from the outer encapsulation; and
connecting a second stacking integrated circuit device to the outer tip over the outer encapsulation.
9. A mountable integrated circuit package system comprising:
a substrate having a through opening provided therein;
an encapsulated integrated circuit package having an external leadfinger, mounted by the external leadfinger proximate to the opening; and
an intraconnect connected between a shoulder of the external leadfinger, that is over the substrate, and the substrate.
10. The system as claimed in claim 9 wherein an outer tip of the external leadfinger is connected over the substrate.
11. The system as claimed in claim 9 further comprising an outer encapsulation over the encapsulated integrated circuit package.
12. The system as claimed in claim 9 further comprising an outer encapsulation formed over the encapsulated integrated circuit package, partially exposing the external leadfinger from the outer encapsulation.
13. The system as claimed in claim 9 further comprising a first external interconnect formed under the substrate.
14. The system as claimed in claim 13 further comprising a first stacking integrated circuit device mounted over the encapsulated integrated circuit package and connected to the external leadfinger.
15. The system as claimed in claim 13 further comprising a first stacking integrated circuit device mounted over the encapsulated integrated circuit package and connected to the substrate.
16. The system as claimed in claim 13 further comprising a first stacking integrated circuit device, mounted under the encapsulated integrated circuit package, and connected to the substrate.
17. The system as claimed in claim 13 further comprising:
an outer encapsulation formed over the encapsulated integrated circuit package with the outer tip leadfinger partially exposed from the outer encapsulation; and
a second stacking integrated circuit device connected to the leadfinger over the outer encapsulation.