Integrated circuit package system with rigid locking lead

1. An integrated circuit package system comprising:

providing a protective layer having a high modulus epoxy compound greater than 19 gigapascals and an opening;

forming a conductive layer over the protective layer and filling the opening;

patterning a rigid locking lead, having both a lead locking portion and a lead exposed portion, from the conductive layer;

connecting an integrated circuit and the rigid locking lead; and

forming an encapsulation over the integrated circuit with the lead locking portion in the encapsulation and the lead exposed portion exposed from the encapsulation.

2. The system as claimed in claim 1 further comprising:

patterning a paddle from the conductive layer; and

mounting the integrated circuit over the paddle.

3. The system as claimed in claim 1 further comprising:

patterning a paddle from the conductive layer; and

connecting the integrated circuit and the paddle.

4. The system as claimed in claim 1 wherein forming the encapsulation includes forming the encapsulation non-planar with the lead exposed portion.

5. An integrated circuit package system comprising:

providing a protective layer having an opening with the protective layer having a high modulus value of greater than 19 gigapascals;

plating a conductive layer over the protective layer and filling the opening;

patterning a rigid locking lead, having both a lead locking portion and a lead exposed portion, from the conductive layer;

connecting an integrated circuit and the rigid locking lead; and

forming an encapsulation over the integrated circuit with the lead locking portion in the encapsulation and the lead exposed portion exposed from the encapsulation.

6. The system as claimed in claim 5 wherein forming the encapsulation includes covering the protective layer.

7. The system as claimed in claim 5 further comprising:

patterning a paddle from the conductive layer;

mounting the integrated circuit over the paddle; and

wherein forming the encapsulation includes:

forming the encapsulation non-planar with the paddle.

8. The system as claimed in claim 5 wherein connecting the integrated circuit and the rigid locking lead includes connecting the integrated circuit and the lead locking portion.

9. The system as claimed in claim 5 wherein forming the encapsulation includes forming the encapsulation coplanar with the protective layer.

10. An integrated circuit package system comprising:

a protective layer having a nigh modulus epoxy molding compound greater than 19 gigapascals and an opening;

a rigid locking lead, having both a lead locking portion and a lead exposed portion, over the protective layer with the lead exposed portion in the opening;

an integrated circuit connected with the rigid locking lead; and

an encapsulation over the integrated circuit with the lead locking portion in the encapsulation and the lead exposed portion exposed from the encapsulation.

11. The system as claimed in claim 10 further comprising a paddle with the integrated circuit mounted thereover.

12. The system as claimed in claim 10 further comprising a paddle with the integrated circuit connected thereto.

13. The system as claimed in claim 10 wherein the encapsulation is non-planar with the lead exposed portion.

14. The system as claimed in claim 10 wherein:

the encapsulation is non-planar with the lead exposed portion; and

the rigid locking lead includes the lead locking portion over the protective layer and the lead exposed portion in the opening.

15. The system as claimed in claim 14 wherein the encapsulation is over the protective layer.

16. The system as claimed in claim 14 further comprising:

a paddle with the integrated circuit mounted thereover; and

wherein the encapsulation is non-planar with the paddle.

17. The system as claimed in claim 14 wherein the integrated circuit connected with the lead locking portion.

18. The system as claimed in claim 14 wherein the encapsulation includes is coplanar with the protective layer.