Inline integrated circuit system

1. An integrated circuit package system comprising:

providing a leadframe having a side rail, and a mold line with an integrated circuit mounted thereover;

encapsulating the integrated circuit with an encapsulation;

mounting an etch barrier to the side rail and the mold line; and

etching the leadframe.

2. The system as claimed in claim 1 wherein:

mounting an etch barrier to the side rail and the mold line includes mounting a tape under the side rail and the mold line.

3. The system as claimed in claim 1 wherein:

mounting an etch barrier to the side rail and the mold line includes mounting photoresist under the side rail and the mold line.

4. The system as claimed in claim 1 wherein:

mounting an etch barrier to the side rail and the mold line includes mounting a mold part under the side rail and the mold line.

5. The system as claimed in claim 1 further comprising:

mounting an etch barrier above the side rail;

molding individual packages above the lead frame; and

testing the individual packages.

6. The system as claimed in claim 5 wherein:

mounting an etch barrier above the side rail includes mounting a tape above the side rail.

7. The system as claimed in claim 5 wherein:

mounting an etch barrier above the side rail includes mounting a guide rail above the side rail.

8. The system as claimed in claim 5 wherein:

testing the individual packages includes testing them individually.

9. The system as claimed in claim 5 further comprising:

providing a leadframe with sticky tape;

mounting the individual packages on the leadframe and testing the individual packages individually.

10. The system as claimed in claim 5 further comprising:

providing a leadframe with sticky tape;

mounting the individual packages on the leadframe and testing the individual packages together as a strip.