Integrated circuit package-in-package system with wire-in-film encapsulant
A multiple encapsulation integrated circuit package-in-package system includes: dicing a top integrated circuit wafer having a bottom encapsulant thereon to form a top integrated circuit die with the bottom encapsulant; positioning internal leadfingers adjacent and connected to a bottom integrated circuit die; pressing the bottom encapsulant on to the bottom integrated circuit die; connecting the top integrated circuit die to external leadfingers adjacent the internal leadfingers; and forming a top encapsulant over the top integrated circuit die.
1. A multiple encapsulation integrated circuit package-in-package system comprising:
a bottom integrated circuit die;
internal leadfingers adjacent and connected to the bottom integrated circuit die;
a bottom encapsulant over the bottom integrated circuit die and the internal leadfingers;
external leadfingers adjacent the internal leadfingers;
a top integrated circuit die bonded on the bottom encapsulant connected to the external leadfingers;
a top encapsulant over the top integrated circuit die and the bottom encapsulant; and
a stiffener over the top encapsulant.
2. The system as claimed in claim 1 wherein the top encapsulant is a mold compound molded around the around the top integrated circuit die, the bottom encapsulant and the internal leadfingers.
3. The system as claimed in claim 1 wherein the bottom encapsulant and the top encapsulant have vertical sides.
4. The system as claimed in claim 1 further comprising a die attach paddle having the bottom integrated circuit die mounted thereon.
5. The system as claimed in claim 1 wherein the bottom encapsulant is a curable encapsulant.
6. The system as claimed in claim 5 further comprising:
an adhesive layer on the stiffener;
a buffer layer on the adhesive layer; and
wherein:
the top encapsulant is a curable encapsulant; and
the top encapsulant is bonded on to the buffer layer.
7. The system as claimed in claim 5 wherein:
the bottom encapsulant on the bottom integrated circuit die leaves a portion of the internal leadfingers extending from the bottom encapsulant; and
the internal leadfingers and the external leadfingers are interconnected.
8. The system as claimed in claim 5 wherein the stiffener includes a heat sink.
9. The system as claimed in claim 5 wherein:
the bottom encapsulant leaves portions of the bottom of the bottom integrated circuit die and the bottom of the internal leadfingers protruding; and
the top encapsulant leaves portions of the bottoms of the external leadfingers protruding.